Printed circuit board and image forming apparatus
A printed circuit board for mounting on a support member, the printed circuit board including: a plurality of mounted portions for mounting the printed circuit board on the support member; a ground pattern configured to be electrically connected to the support member through the plurality of mounted portions; and a slit extended from a first mounted portion to a second mounted portion of the plurality of mounted portions and between a first portion, in which an electronic device is provided, of the ground pattern and a second portion, in which an electronic device is not provided, of the ground pattern.
1. A printed circuit board, comprising:
an electric part;
a conductive layer provided on a predetermined surface on which the electric part is mounted;
a first portion through which a first through hole for screw-clamping is formed; and
a second portion through which a second through hole for screw-clamping is formed,
wherein the conductive layer includes a ground conductor which is used for grounding the electric part and a separate conductor which is provided around the first through hole on the predetermined surface,
wherein a gap area is formed between the separate conductor and another conductor including the ground conductor in the conductive layer, and
wherein an area on which the ground conductor is provided includes an area around the second through hole on the predetermined surface.
2. The printed circuit board according to claim 1 , wherein the printed circuit board comprises a two-layer board.
3. An image forming apparatus that forms an image on a recording medium, the image forming apparatus comprising:
a printed circuit board supported to a support member with screws,
wherein the printed circuit board includes:
an electric part;
a conductive layer provided on a predetermined surface on which the electric part is mounted;
a first portion through which a first through hole for screw-clamping is formed; and
a second portion through which a second through hole for screw-clamping is formed,
wherein the conductive layer includes a ground conductor which is used for grounding the electric part and a separate conductor which is provided around the first through hole on the predetermined surface,
wherein a gap area is formed between the separate conductor and another conductor including the ground conductor in the conductive layer, and
wherein an area on which the ground conductor is provided includes an area around the second through hole on the predetermined surface.
4. The printed circuit board according to claim 1 , further comprising an insulation layer that coats the conductive layer,
wherein on the predetermined surface, an area around the first through hole is not coated with the insulation layer, and
wherein on the predetermine surface, the area around the second through hole is not coated with the insulation layer.
5. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface and
another conductive layer mounted on the back surface,
wherein the another conductive layer includes another ground conductor which is used for grounding the another electric part, and
wherein an area on which the anther ground conductor is provided includes an area around the first through hole on the back surface and an area around the second through hole on the back surface.
6. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface; and
another conductive layer mounted on the back surface,
wherein the another conductive layer includes a conductive pattern configured to supply a power source voltage to the another electric part and another ground conductor which is used for grounding the another electric part,
wherein an area on which the another ground conductor is provided includes an area around the first through hole on the back surface and an area around the second through hole on the back surface, and
wherein the another ground conductor is provided with a slit formed between the first through hole and the conductive pattern on the back surface.
7. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface; and
another conductive layer provided on the back surface,
wherein the another conductive layer includes a conductive pattern configured to supply a power source voltage to the another electric part and another ground conductor which is used for grounding the another electric part,
wherein an area on which the another ground conductor is provided includes an area around the first through hole on the back surface and an area around the second through hole on the back surface,
wherein the another ground conductor is provided with a slit formed between the first through hole and the conductive pattern on the back surface, and
wherein on the back surface, the first through hole is located between another through hole for screw-clamping formed on the back surface and another through hole for screw-camping formed on the back surface in a longitudinal direction of the slit.
8. The printed circuit board according to claim 1 , further comprising a third portion through which a third through hole for screw-clamping is formed,
wherein the conductive layer further includes another separate conductor provided around the third through hole on the predetermined surface, and
wherein another gap area is formed between the another separate conductor and the another conductor.
9. The printed circuit board according to claim 1 , further comprising:
a third portion through which a third through hole for screw-clamping is formed;
another electric part mounted on a back surface different from the predetermined surface; and
another conductive layer mounted on the back surface,
wherein the conductive layer further includes another separate conductor provided around the third through hole on the predetermined surface,
wherein another gap area is formed between the another separate conductor and the another conductor,
wherein the another conductive layer includes a conductive pattern configured to supply a power source voltage to the another electric part and another ground conductor which is used for grounding the another electric part,
wherein an area on which the another ground conductor is provided includes an area around the first through hole on the back surface, and an area around the second through hole on the back surface, and an area around the third through hole on the back surface,
wherein the another ground conductor is provided with a slit formed between the first through hole and the conductive pattern on the back surface, and
wherein on the back surface, the first through hole is located between the second through hole on the back surface and the third through hole on the back surface in a longitudinal direction of the slit.
10. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface;
another ground conductor provided on the back surface; and
a via hole electrically connecting the ground conductor on the predetermined surface and the another ground conductor on the back surface.
11. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface;
another ground conductor provided on the back surface; and
a via hole electrically connecting the separate conductor on the predetermined surface and the another ground conductor on the back surface.
12. The printed circuit board according to claim 1 , wherein the conductive layer includes a conductive pattern configured to supply a power source voltage to the electric part, and
wherein a distance from the first through hole to the conductive pattern is shorter than a distance from the second through hole to the conductive pattern.
13. The printed circuit board according to claim 1 , wherein a back surface different from the predetermined surface of the printed circuit board is opposite to a frame in a state in which the printed circuit board is attached to the frame with screws.
14. The printed circuit board according to claim 1 , further comprising:
another electric part mounted on a back surface different from the predetermined surface; and
another conductive layer mounted on the back surface,
wherein the another conductive layer includes a conductive pattern configured to supply a power source voltage to the another electric part and another ground conductor which is used for grounding the another electric part,
wherein an area on which the another ground conductor is provided includes an area around the first through hole on the back surface and an area around the second through hole on the back surface,
wherein the another ground conductor is provided with a slit formed between the first through hole and the conductive pattern on the back surface, and
wherein the back surface different from the predetermined surface of the printed circuit board is opposite to a frame in a state in which the printed circuit board is attached to the frame with screws.
15. The printed circuit board according to claim 1 , wherein a width of the gap area on the predetermined surface is 1.5 mm or more and 2.5 mm or less.
16. The image forming apparatus according to claim 3 , further comprising an insulation layer that coats the conductive layer,
wherein on the predetermined surface, an area around the first through hole is not coated with the insulation layer, and
wherein on the predetermined surface, the area around the second through hole is not coated with the insulation layer.
17. The image forming apparatus according to claim 3 , further comprising:
a third portion through which a third through hole for screw-clamping is formed;
another electric part mounted on a back surface different from the predetermined surface; and
another conductive layer mounted on the back surface,
wherein the conductive layer further includes another separate conductor provided around the third through hole on the predetermined surface,
wherein another gap area is formed between the another separate conductor and the another conductor,
wherein the another conductive layer includes a conductive pattern configured to supply a power source voltage to the another electric part and another ground conductor which is used for grounding the another electric part,
wherein an area on which the another ground conductor is provided includes an area around the first through hole on the back surface, and an area around the second through hole on the back surface, and an area around the third through hole on the back surface,
wherein the another ground conductor is provided with a slit formed between the first through hole and the conductive pattern on the back surface, and
wherein on the back surface, the first through hole is located between the second through hole on the back surface and the third through hole on the back surface in a longitudinal direction of the slit.
18. The image forming apparatus according to claim 3 , wherein a width of the gap area on the predetermined surface is 1.5 mm or more and 2.5 mm or less.