Dielectric filler material in conductive material that functions as fiducial for an electronic device
An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
1. An electronic device, comprising:
a substrate including one or more layers, the one or more layers including a dielectric material and one or more electrical traces;
a cavity defined in the substrate, wherein the cavity is adapted to receive a semiconductor die;
a layer of conductive material, wherein the layer of conductive material defines a void in the conductive material;
a fiducial mark including a filler material positioned in the void defined by the conductive material and coupled to the layer of conductive material, wherein the fiducial mark is positioned proximate the cavity defined in the substrate; and
wherein the filler material has a lower reflectivity in comparison to the conductive material to provide a contrast with the conductive material.
2. The electronic device of claim 1 , further comprising the semiconductor die, wherein the semiconductor die is positioned in the cavity and coupled to the substrate.
3. The electronic device of claim 2 , wherein the semiconductor die is a first semiconductor die, and the first semiconductor die is adapted to electrically interconnect a second semiconductor die and a third semiconductor die.
4. The electronic device of claim 2 , wherein the fiducial mark is adapted to locate the semiconductor die with respect to the cavity defined in the substrate.
5. The electronic device of claim 1 , wherein a periphery of the cavity defined by the substrate is rectangular, and the fiducial mark is positioned proximate a corner of the cavity.
6. The electronic device of claim 5 , wherein the fiducial mark is a first fiducial mark, and the first fiducial mark is positioned proximate a first side of the corner, and further comprising a second fiducial mark, wherein the second fiducial mark is positioned proximate a second side of the corner.
7. The electronic device of claim 1 , wherein the cavity defined in the substrate extends only partially through a thickness of the substrate.