Interconnect structure of three-dimensional memory device
Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a substrate, an alternating layer stack including a staircase structure on the substrate, and a barrier structure extending vertically through the alternating layer stack. The alternating layer stack includes an alternating dielectric stack and an alternating conductor/dielectric stack. The alternating dielectric stack includes dielectric layer pairs enclosed by at least the barrier structure. The alternating conductor/dielectric stack includes conductor/dielectric layer pairs. The memory device further includes a channel structure and a slit structure each extending vertically through the alternating conductor/dielectric stack, an etch stop layer on an end of the channel structure, and first contacts. Each of a conductor layer of the alternating conductor/dielectric stack in the staircase structure, the etch stop layer, and the slit structure is in contact with one of the first contacts.
1. A three-dimensional (3D) NAND memory device, comprising:
a substrate;
an alternating layer stack on the substrate, the alternating layer stack comprising a staircase structure;
a barrier structure extending vertically through the alternating layer stack, wherein the alternating layer stack comprises (i) an alternating dielectric stack comprising a plurality of dielectric layer pairs enclosed laterally by at least the barrier structure, and (ii) an alternating conductor/dielectric stack comprising a plurality of conductor/dielectric layer pairs;
a channel structure and a slit structure each extending vertically through the alternating conductor/dielectric stack;
an etch stop layer on an end of the channel structure;
a plurality of first contacts, an interconnect conductor layer, and a contact layer comprising a plurality of second contacts, wherein each of (i) a conductor layer of the alternating conductor/dielectric stack in the staircase structure, (ii) the etch stop layer, and (iii) the slit structure is electrically connected to the interconnect conductor layer by a corresponding first contact and a respective one of the plurality of second contacts.
2. The memory device of claim 1 , wherein the etch stop layer comprises one or more of polysilicon, titanium, titanium nitride, and tungsten.
3. The memory device of claim 1 , wherein the barrier structure comprises silicon oxide and silicon nitride.
4. The memory device of claim 1 , further comprising a dummy channel structure extending vertically through the alternating conductor/dielectric stack.
5. The memory device of claim 1 , wherein each of the plurality of dielectric layer pairs comprises a silicon oxide layer and a silicon nitride layer, and each of the plurality of conductor/dielectric layer pairs comprises a metal layer and a silicon oxide layer.
6. The memory device of claim 1 , further comprising a third contact extending vertically through the alternating dielectric stack enclosed laterally by at least the barrier structure.
7. A three-dimensional (3D) memory device, comprising:
a substrate;
an alternating conductor/dielectric stack on the substrate, the alternating conductor/dielectric stack comprising a staircase structure;
a NAND string and a slit structure each extending vertically through the alternating conductor/dielectric stack;
a plurality of first contacts flush with one another at a respective first end of each of the first contacts, wherein each of (i) a conductor layer of the alternating conductor/dielectric stack in the staircase structure, (ii) the NAND string, and (iii) the slit structure is in contact with a respective second end of the plurality of first contacts;
a contact layer comprising a plurality of second contacts flush with one another at a respective first end and a respective second end of each of the second contacts, wherein each of the plurality of second contacts is in contact with a respective one of the plurality of first contacts; and
an interconnect conductor layer comprising a plurality of interconnect lines, wherein each of the plurality of second contacts is in contact with a respective one of the plurality of interconnect lines.
8. The memory device of claim 7 , wherein the plurality of interconnect lines comprise a bit line electrically connected to the NAND string by a corresponding first contact and a corresponding second contact.
9. The memory device of claim 7 , further comprising:
a barrier structure; and
an alternating dielectric stack separated laterally from the alternating conductor/dielectric stack by the barrier structure.
10. The memory device of claim 9 , wherein the plurality of first contacts comprise a through array contact (TAC) extending vertically through the alternating dielectric stack.
11. The memory device of claim 7 , wherein the NAND string comprises a plug in contact with a corresponding first contact.
12. The memory device of claim 11 , wherein the plug comprises at least one of a polysilicon and a metal.