IP Library › Granted Patent US 10,847,561
Granted Patent B2
US 10,847,561 · App. 16/336,009 · Granted Nov 24, 2020

Solid-state imaging element and method for manufacturing the same, and electronic device

Inventors: Kouichi Itabasi (Kumamoto, JP); Yuuji Nishimura (Kumamoto, JP); Mitsuru Ishikawa (Kumamoto, JP); Yuichi Seki (Kumamoto, JP); Masaya Shimoji (Kumamoto, JP)
Assignee: Sony Semiconductor Solutions Corporation
H01L27/14627H01L27/1462H01L27/14621H01L27/14685
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Quick Facts
Patent No.
US 10,847,561
App. No.
16/336,009
Granted
Nov 24, 2020
Kind
B2
Abstract

The present technology relates to a solid-state imaging element that is capable of suppressing occurrence of flares, ghosts, and color-mixing, and is capable of suppressing occurrence of stains caused by moisture and a method for manufacturing the same, and an electronic device. The solid-state imaging element includes a pixel in which a single-layered anti-reflective film is formed on a surface of a microlens and a pixel in which a double-layered anti-reflective film is formed on the surface of the microlens. For example, the present technology is applicable to a rear surface irradiation-type solid-state imaging element.

Claims (49)

1. A solid-state imaging element, comprising:

a plurality of pixels, wherein each of the plurality of pixels includes:

a photoelectric conversion unit configured to perform photoelectric conversion in correspondence with incident light; and

a microlens configured to condense the incident light to the photoelectric conversion unit, wherein

a first pixel of the plurality of pixels has a multi-layered anti-reflective film on a surface of the microlens,

a second pixel of the plurality of pixels has a single-layered anti-reflective film on the surface of the microlens,

the second pixel is obtained based on removal of a first anti-reflective film of the multi-layered anti-reflective film from the first pixel, and

a moisture permeability of the first anti-reflective film is lower than a moisture permeability of the single-layered anti-reflective film.

2. The solid-state imaging element according to claim 1 , wherein at least one-fourth pixels of the plurality of pixels include the single-layered anti-reflective film on the surface of the microlens.

3. The solid-state imaging element according to claim 1 , wherein

each of the plurality of pixels further includes a color filter between the photoelectric conversion unit and the microlens,

each of a set of pixels of the plurality of pixels has a specific color, and

each of the set of pixels includes the single-layered anti-reflective film on the surface of the microlens.

4. The solid-state imaging element according to claim 3 , wherein

the color filter is in a Bayer array, and

each of the set of pixels is set to green (G).

5. The solid-state imaging element according to claim 3 , wherein

the color filter is in a Bayer array, and

each of the set of pixels is set to blue (B).

6. The solid-state imaging element according to claim 1 , wherein

the multi-layered anti-reflective film includes the first anti-reflective film and a second anti-reflective film,

the single-layered anti-reflective film includes the second anti-reflective film,

the first anti-reflective film is one of a silicon nitride film or a silicon oxynitride film, and

the second anti-reflective film is one of a silicon oxide film or a silicon oxycarbide film.

7. The solid-state imaging element according to claim 6 , wherein

a first refractive index of the first anti-reflective film is higher than a second refractive index of the microlens, and

the second refractive index of the microlens is higher than a third refractive index of the second anti-reflective film.

8. The solid-state imaging element according to claim 1 , wherein a type of the solid-state imaging element is a rear surface irradiation type.

9. A method for manufacturing a solid-state imaging element, the method comprising:

forming, in each of a plurality of pixels, a microlens that condenses incident light to a photoelectric conversion unit;

forming a multi-layered anti-reflective film on a surface of the microlens in a first pixel of the plurality of pixels; and

forming a single-layered anti-reflective film on the surface of the microlens in a second pixel of the plurality of pixels, wherein

the single-layered anti-reflective film is formed based on a removal of an anti-reflective film of the multi-layered anti-reflective film from the first pixel, and

a moisture permeability of the anti-reflective film is lower than a moisture permeability of the single-layered anti-reflective film.

10. An electronic device, comprising:

a solid-state imaging element comprises a plurality of pixels, wherein each of the plurality of pixels includes:

a photoelectric conversion unit configured to perform photoelectric conversion in correspondence with incident light; and

a microlens configured to condense the incident light to the photoelectric conversion unit, wherein

a first pixel of the plurality of pixels has a multi-layered anti-reflective film on a surface of the microlens,

a second pixel of the plurality of pixels has a single-layered anti-reflective film on the surface of the microlens,

the second pixel is obtained based on removal of an anti-reflective film of the multi-layered anti-reflective film from the first pixel, and

a moisture permeability of the anti-reflective film is lower than a moisture permeability of the single-layered anti-reflective film.

11. A solid-state imaging element, comprising:

a plurality of pixels, wherein each of the plurality of pixels includes:

a photoelectric conversion unit configured to perform photoelectric conversion in correspondence with incident light; and

a microlens configured to condense the incident light to the photoelectric conversion unit, wherein

a first pixel of the plurality of pixels has a multi-layered anti-reflective film on a surface of the microlens,

a second pixel of the plurality of pixels has a single-layered anti-reflective film on the surface of the microlens, and

a type of the solid-state imaging element is a rear surface irradiation type.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2019
From: ITABASI, KOUICHI; NISHIMURA, YUUJI; ISHIKAWA, MITSURU; SEKI, YUICHI; SHIMOJI, MASAYA
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 048679/0132 →
Priority Claims (1)
JP 2016-200642 · Oct 12, 2016 · national
Continuity (1)
Related Publication 20200185443A1 · Jun 11, 2020
Cited By (1)
US 12,575,205