Semiconductor device
A semiconductor device is provided, including: a semiconductor substrate; a first-conductivity-type drift region provided in the semiconductor substrate; a gate trench portion extending in a predetermined extending direction in a plane of the upper surface of the semiconductor substrate; a mesa portion provided in contact with the gate trench portion in an array direction orthogonal to the extending direction; a first-conductivity-type accumulation region provided above the drift region and in contact with the gate trench portion, and having a higher doping concentration than the drift region; a second-conductivity-type base region provided above the accumulation region and in contact with the gate trench portion; and a second-conductivity-type floating region provided below the accumulation region and in contact with the gate trench portion, and provided in a part of the mesa portion in the array direction.
1. A semiconductor device comprising:
a semiconductor substrate;
a first-conductivity-type drift region provided in the semiconductor substrate;
a gate trench portion provided from an upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in a predetermined extending direction in a plane of the upper surface of the semiconductor substrate;
a mesa portion provided in contact with the gate trench portion in an array direction orthogonal to the extending direction;
a second-conductivity-type base region provided in the mesa portion above the drift region and in contact with the gate trench portion; and
a second-conductivity-type floating region provided in the mesa portion below the base region and in contact with the gate trench portion, and provided in a part of the mesa portion in the array direction, wherein
the doping concentration of the floating region is higher than the doping concentration of the base region.
2. The semiconductor device according to claim 1 , wherein the floating region is spaced apart from the accumulation regions in a depth direction of the semiconductor substrate.
3. The semiconductor device according to claim 2 , wherein at least a part of the floating region in the depth direction of the semiconductor substrate is provided in contact with a bottom portion of the gate trench portion.
4. The semiconductor device according to claim 3 , comprising a plurality of the accumulation regions arranged along a depth direction of the semiconductor substrate.
5. The semiconductor device according to claim 4 , wherein one of the plurality of accumulation regions that is provided at a lowest position has a lower doping concentration than one of the plurality of accumulation regions that is provided at an uppermost position.
6. The semiconductor device according to claim 1 , wherein a distance between the base region and the floating region in a depth direction of the semiconductor substrate is larger than a width of the base region in the depth direction of the semiconductor substrate.
7. The semiconductor device according to claim 1 , wherein a width of the floating region in the array direction is between 0.1 times and 0.5 times, inclusive, of a width of the mesa portion in the array direction.
8. The semiconductor device according to claim 1 , wherein
the drift region is provided in a region of the mesa portion in direct contact with the floating region in the array direction, and
a width of the floating region in the array direction is smaller than a width of the drift region in the array direction at a depth at which the floating region is provided.
9. The semiconductor device according to claim 1 , wherein the floating region has a higher doping concentration than the accumulation regions.
10. The semiconductor device according to claim 9 , wherein the doping concentration of the floating region is 1×10 19 /cm 3 or more.
11. The semiconductor device according to claim 10 , further comprising:
a dummy trench portion provided from the upper surface of the semiconductor substrate to an inside of the semiconductor substrate, extending in the extending direction in the plane of the upper surface of the semiconductor substrate, and sandwiching the mesa portion with the gate trench portion; and
a second-conductivity-type floating region provided in the mesa portion below the accumulation regions and in contact with the dummy trench portion, and provided in a part of the mesa portion in the array direction, wherein
the floating region contacting the gate trench portion and the floating region contacting the dummy trench portion are spaced apart in the array direction.
12. The semiconductor device according to claim 1 , wherein a transistor section including the gate trench portion and a diode section are provided in the semiconductor substrate, wherein
the diode section comprises:
the drift region;
a dummy trench portion provided from the upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in the extending direction;
a mesa portion provided in contact with the dummy trench portion in the array direction; and
the base region provided in the mesa portion above the drift region and in contact with the dummy trench portion, and
no floating region is provided for the dummy trench portion provided in the diode section.
13. A semiconductor device comprising:
a semiconductor substrate:
a first-conductivity-type drift region provided in the semiconductor substrate;
a gate trench portion provided from an upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in a predetermined extending direction in a plane of the upper surface of the semiconductor substrate;
a mesa portion provided in contact with the gate trench portion in an array direction orthogonal to the extending direction;
one or more first-conductivity-type accumulation regions provided in the mesa portion above the drift region and in contact with the gate trench portion, and having a higher doping concentration than the drift region;
a second-conductivity-type base region provided in the mesa portion above the accumulation regions and in contact with the gate trench portion; and
a second-conductivity-type floating region provided in the mesa portion below the accumulation regions and in contact with the gate trench portion, and provided in a part of the mesa portion in the array direction, wherein a transistor section including the gate trench portion and a boundary section included in the transistor section are provided in the semiconductor substrate, wherein
the boundary section comprises:
the drift region;
a dummy trench portion provided from the upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in the extending direction;
a mesa portion provided in contact with the dummy trench portion in the array direction; and
the base region provided in the mesa portion above the drift region and in contact with the dummy trench portion, and
no floating region is provided for the dummy trench portion provided in the boundary section.
14. The semiconductor device according to claim 1 , wherein a plurality of the floating regions are discretely arranged along the extending direction of the gate trench portion.
15. The semiconductor device according to claim 14 , wherein
an first-conductivity-type emitter region having a higher doping concentration than the drift region and a second-conductivity-type contact region are alternately arranged along the extending direction in a plane of an upper surface of the mesa portion contacting the gate trench portion, and
each of the floating regions is provided over a larger area in the extending direction than the emitter region.
16. A semiconductor device comprising:
a semiconductor substrate;
a first-conductivity-type drift region provided in the semiconductor substrate;
a gate trench portion provided from an upper surface of the semiconductor substrate to an inside of the semiconductor substrate, and extending in a predetermined extending direction in a plane of the upper surface of the semiconductor substrate;
a mesa portion provided in contact with the gate trench portion in an array direction orthogonal to the extending direction;
a second-conductivity-type base region provided in the mesa portion above the drift region and in contact with the gate trench portion; and
a second-conductivity-type floating region provided in the mesa portion below the base region and in contact with the gate trench portion, and provided in a part of the mesa portion in the array direction, wherein
a distance between the base region and the floating region in a depth direction of the semiconductor substrate is larger than a width of the base region in the depth direction of the semiconductor substrate.
17. The semiconductor device according to claim 1 , further comprising
one or more first-conductivity-type accumulation regions provided in the mesa portion above the drift region and in contact with the gate trench portion, and having a higher doping concentration than the drift region, wherein
the second-conductivity-type base region is provided in the mesa portion above the accumulation regions.