Optical package and method of producing an optical package

1. An optical package, comprising:

a carrier comprising electrical interconnections,

an optoelectric component arranged for detecting and/or emitting electromagnetic radiation in a specified wavelength range, mounted on the carrier or integrated into the carrier, and electrically connected to the electric interconnections,

an aspheric lens having an upper surface, a lateral surface, and a bottom surface, wherein the bottom surface is arranged at or near the optoelectric component, wherein the upper surface is smaller than the bottom surface, and wherein the aspheric lens comprises a material which is at least transparent in the specified wavelength range, and

a reflective layer comprising a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.

2. The optical package according to claim 1 , wherein

the aspheric lens has an optical axis, and

the lateral surface, at least in sections, has an aspheric surface profile with respect to the optical axis.

3. The optical package according to claim 2 , wherein the aspheric surface profile, at least in sections, is

hyperbolic,

parabolic,

elliptical, and/or

linear,

conical, and/or

tapered

or a frustum thereof.

4. The optical package according to claim 3 , wherein a length of the aspheric lens along its optical axis is at least equal or greater than a width of the bottom surface.

5. The optical package according to claim 4 , wherein the width of the bottom surface is at least equal or greater than a width of a light sensitive area or light emitting area of the optoelectric component.

6. The optical package according to claim 1 , further comprising an encasement which is arranged on the carrier, wherein

the encasement comprises a filler material, and

the encasement comprises sidewalls which at least partly enclose the lateral surface of the aspheric lens.

7. The optical package according to claim 6 , wherein

the reflective layer is coated onto the lateral surface of the aspheric lens or

the reflective layer is coated onto the sidewalls of the encasement.

8. The optical package according to claim 1 , wherein

the reflective layer covers the lateral surface completely, and/or

the reflective layer covers at least parts of a main surface of the carrier, in particular covers the main surface of the carrier completely.

9. The optical package according to claim 1 , wherein the reflective material of the reflective layer comprises at least one type of metal and/or a metal alloy, in particular, aluminum, chrome, gold, silver and/or an alloy thereof.

10. The optical package according to claim 1 , wherein the filler material is opaque at least in the specified wavelength range, in particular the filler material comprises a moldable material.

11. The optical package according to claim 1 , wherein the optoelectric component comprises:

an optical sensor,

an ambient light sensor,

a color sensor, and/or

an optical proximity sensor.

12. The optical package according to claim 1 , wherein the optoelectric component comprises:

a photodiode, and/or

a light emitting diode.

13. The optical package according to claim 1 , wherein the encasement comprises an aperture at or near the upper surface arranged for light entrance into the aspheric lens.

14. The optical package according to claim 1 , wherein a diffuser is arranged at or near the upper surface of the aspheric lens.

15. A method of producing an optical package, the method comprising:

providing a wafer as a carrier having electrical interconnections,

mounting a plurality of optoelectric components on the wafer or into the wafer, wherein the optoelectric components are arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range,

electrically connecting the optoelectric components to the electric interconnections,

forming a plurality of aspheric lenses, each having a respective upper surface, a respective lateral surface, and a respective bottom surface from a material which is at least transparent in the specified wavelength range, wherein each of the bottom surfaces is arranged at or near a respective one of the optoelectric components, and wherein each of the upper surfaces is smaller than a respective one of the bottom surfaces,

arranging the aspheric lenses with each of the bottom surfaces at or near a respective one of the optoelectric components, and

at least partly covering the upper surfaces and the lateral surfaces of the aspheric lenses with a reflective layer comprising a reflective material, wherein the reflective material is at least partly reflective in the specified wavelength range,

forming an encasement on the wafer using a filler material such that sidewalls are formed which at least partly enclose the lateral surfaces of the aspheric lenses, and such that apertures are formed in the encasement at or near the upper surfaces of the aspheric lenses,

wherein the upper surfaces of the aspheric lenses protrude into the aperture or the upper surfaces are modified to be flush with an outer surface of the encasement,

removing at least a portion of the reflective layer from the upper surfaces, and

singulating the wafer carrying the plurality of optoelectric components into single optical packages.

16. The method according to claim 15 , wherein the reflective layer is coated at least on the sidewalls of the encasement or the reflective layer is coated on the lateral surfaces of the aspheric lenses.

17. An optical package, comprising:

a carrier comprising electrical interconnections,

an optoelectric component arranged for detecting and/or emitting electromagnetic radiation in a specified wavelength range, mounted on the carrier or integrated into the carrier, and electrically connected to the electric interconnections,

an aspheric lens having an upper surface, a lateral surface, and a bottom surface opposite the upper surface, wherein the bottom surface is arranged at or near the optoelectric component, wherein the upper surface is smaller than the bottom surface, and wherein the aspheric lens comprises a material which is at least transparent in the specified wavelength range, and

a reflective layer comprising a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range,

wherein the aspheric lens is configured to receive at least a first portion light incident upon the upper surface at a first angle of incidence relative to a normal of the upper surface, and guide the at least first portion of light towards the bottom surface according to a second first angle of incidence relative to the normal of the upper surface, the first angle of incidence being greater than the second angle of incidence.

18. A method of producing an optical package, comprising the steps of:

providing a wafer as carrier having electrical interconnections,

mounting a plurality of optoelectric components on the wafer or into the wafer, wherein the plurality of optoelectric component are arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range,

electrically connecting the plurality of optoelectric component to the electric interconnections,

obtaining a plurality of aspheric lenses, each aspheric lens having a respective upper surface, a respective lateral surface, and a respective bottom surface, the plurality of aspheric lenses being formed from a material which is at least transparent in the specified wavelength range,

arranging each of the aspheric lenses with its bottom surface at or near a respective one of the optoelectric components,

covering the lateral surfaces and the upper surfaces of the plurality of aspheric lenses with a reflective layer comprising a reflective material, wherein the reflective material is at least partly reflective in the specified wavelength range,

forming an encasement on the wafer using a filler material such that sidewalls are formed which at least partly enclose the lateral surfaces of the plurality of aspheric lenses, wherein apertures are formed in the encasement at or near the upper surfaces of the plurality of aspheric lenses,

wherein the upper surfaces of the plurality of aspheric lenses protrude into the apertures or the upper surfaces are modified to be flush with an outer surface of the encasement, and

removing at least a portion of the reflective layer from the upper surface, and

singulating the wafer carrying the plurality of optoelectric components into single optical packages.