High brightness light emitting device with small size

1. A method to fabricate a light emitting device comprising the steps of:

forming a structure, the structure formed by the steps comprising:

a) forming an LED on an LED substrate, wherein the LED comprises GaP, AlGaAs, GaAsP, AlGaP, GaInP, InGaN, SiC, AlGaN, AlN, InN, or InP;

b) forming a reflective layer overlying the LED;

c) forming a thin film transistor overlying the LED, wherein a first interconnect extends through the reflective layer electrically connecting the LED to the thin film transistor;

d) forming a dielectric layer overlying the thin film transistor; and

e) forming a second interconnect and a third interconnect extending through the dielectric layer, wherein the second and third interconnects are electrically connected to the thin film transistor;

flipping the structure comprising the LED, the reflective layer, the thin film transistor, the first, second, and third interconnects, and the dielectric layer, so that, in the completed device, the LED at least partially overlies the thin film transistor, and the reflective layer is disposed between the thin film transistor and the LED; and

removing the LED substrate after the bonding step.

2. The method of claim 1 , further comprising the step of bonding the first interconnect and second interconnect to a backboard.

3. The method of claim 2 , wherein the backboard comprises a printed circuit board or an interposer.

4. The method of claim 1 , further comprising forming a transparent conductive layer in electrical contact with the LED.

5. The method of claim 4 , wherein the transparent conductive layer comprises indium tin oxide, fluorine tin oxide, aluminum zinc oxide, metallic nanoparticles, carbon nanotubes, graphene, or conductive polymers.

6. The method of claim 1 , wherein the reflective layer comprises a Bragg reflector.

7. A method to fabricate an assembly of light emitting devices comprising the steps of:

forming a structure, the structure formed by the steps comprising:

a) forming a plurality of LEDs on an LED substrate, wherein the plurality of LEDs comprises GaP, AlGaAs, GaAsP, AlGaP, GaInP, InGaN, SiC, AlGaN, AlN, InN, or InP;

b) forming a reflective layer;

c) forming a plurality of thin film transistors, wherein each thin film transistor of the plurality of thin film transistors at least partially overlies an LED of the plurality of LEDs;

d) forming a first plurality of interconnects, wherein each interconnect of the plurality extends through the reflective layer;

e) forming a dielectric layer overlying the thin film transistors;

f) forming a second plurality of interconnects extending from the thin film transistors through the dielectric layer;

flipping the structure comprising the plurality of LEDs, the reflective layer, the plurality of thin film transistors, the first and second pluralities of interconnects, and the dielectric layer, so that, in the completed assembly, each LED of the plurality of LEDs at least partially overlies a thin film transistor of the plurality of thin film transistors;

bonding the second plurality of interconnects to a backboard; and

removing the LED substrate after the bonding step.

8. The method of claim 7 , further comprising forming a transparent conductive layer on the plurality of LEDs after removing the LED substrate.

9. The method of claim 8 , wherein the transparent conductive layer comprises indium tin oxide, fluorine tin oxide, aluminum zinc oxide, metallic nanoparticles, carbon nanotubes, graphene, or conductive polymers.

10. The method of claim 7 , further comprising forming at least first and second pluralities of wavelength-converting layers, wherein each wavelength-converting layer overlies an LED of the plurality of LEDs.

11. The method of claim 7 , further comprising forming a plurality of side reflectors, wherein each side reflector is disposed between adjacent LEDs and the side reflectors prevents light from adjacent LEDs from interfering with one another.

12. The method of claim 7 , wherein the reflective layer comprises a Bragg reflector.

13. The method of claim 7 , wherein the backboard comprises a printed circuit board or an interposer.