IP Library › Granted Patent US 10,853,705
Granted Patent B2
US 10,853,705 · App. 16/573,174 · Granted Dec 1, 2020

Collation/retrieval system, collation/retrieval server, image feature extraction apparatus, collation/retrieval method, and program

Inventor: Rui Ishiyama (Tokyo, JP)
Assignee: NEC Corporation
G06K9/78G06K9/00577G06K9/2063G06Q30/0185G06Q30/0278G06K9/46
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Quick Facts
Patent No.
US 10,853,705
App. No.
16/573,174
Granted
Dec 1, 2020
Kind
B2
Abstract

The present invention is a collation/retrieval system collating a product manufactured by or delivered from a producer or a distributor with a product to be collated comprising: a storage unit that stores an image feature of a predetermined collation area of the product determined in advance at a position relative to a reference section common in every product; a to-be-collated product feature extraction unit that receives an image of the product to be collated and detecting the reference section of the product from the received image to extract an image feature of the collation area determined by reference to the reference section; and a collation unit that collates the stored image feature with the image feature of the collation area of the product to be collated.

Claims (36)

1. A collation apparatus comprising:

a storage device configured to store first image features and management information in a mutually associated manner, wherein

the first image features are extracted from first surface images of metal workpieces or semiconductor chips, and

the management information correspond to the metal workpieces or semiconductor chips;

a memory configured to store instructions; and

a processor coupled to the memory and configured to execute the instructions to:

obtain a second surface image of a metal workpiece or a semiconductor chip,

collate a second image feature with the first image features, wherein the second image feature is extracted from the second surface image, and

in response to matching the second image feature with one of the first image features, output the management information associated with the one of the first image features, wherein the management information includes at least one of a production site, a producer name, a lot number, a production date, a quality information, a shipping point, and a ship date of the metal workpiece or the semiconductor chip corresponding to the second surface image.

2. The collation apparatus according to claim 1 , wherein the processor is configured to execute the instructions to output the management information to a user's device.

3. The collation apparatus according to claim 2 , wherein the user's device is at least one of a smartphone, a mobile phone, and a device having a camera function.

4. A collation method performed by a processor executing instructions stored on a memory coupled to the processor, the collation method comprising:

obtaining a second surface image of a metal workpiece or a semiconductor chip;

collating a second image feature with first image features, wherein

the first image features are stored in a storage device,

the second image feature is extracted from the second surface image, and

the storage device stores the first image features and management information in a mutually associated manner, wherein

the first surface features are extracted from first surface images of metal workpieces or semiconductor chips, and

the management information correspond to the metal workpieces or the semiconductor chips; and

in response to matching the second image feature with one of the first image features, outputting the management information associated with the one of the first image features, wherein the management information includes at least one of a production site, a producer name, a lot number, a production date, a quality information, a shipping point, and a ship date of the metal workpiece or the semiconductor chip corresponding to the second surface image.

5. The collation method according to claim 4 , wherein the the outputting step comprises outputting the management information to a user's device.

6. The collation method according to claim 5 , wherein the user's device is at least one of a smartphone, a mobile phone, and a device having a camera function.

7. A collation system comprising:

a storage device configured to store first image features and management information in a mutually associated manner, wherein

the first image features are extracted from first surface images of metal workpieces or semiconductor chips, and

the management information correspond to the metal workpieces or semiconductor chips;

at least one memory configured to store instructions; and

at least one processor coupled to the at least one memory and configured to execute the instructions to:

obtain a second surface image of a metal workpiece or a semiconductor chip,

collate a second image feature with the first image features, wherein the second image feature is extracted from the second surface image, and

in response to matching the second image feature with one of the first image features, output the management information associated with the one of the first image features, wherein the management information includes at least one of a production site, a producer name, a lot number, a production date, a quality information, a shipping point, and a ship date of the metal workpiece or the semiconductor chip corresponding to the second surface image.

8. The collation system according to claim 7 , wherein the at least one processor is configured to execute the instructions to output the management information to a user's device.

9. The collation system according to claim 8 , wherein the user's device is at least one of a smartphone, a mobile phone, and a device having a camera function.

10. The collation apparatus according to claim 1 , wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.

11. The collation method according to claim 4 , wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.

12. The collation system according to claim 7 , wherein each first surface image is a unique surface image of the corresponding metal workpiece or semiconductor chip.

Priority Claims (1)
JP 2011-166789 · Jul 29, 2011 · national
Continuity (3)
Continuation 15718648 · Sep 28, 2017
Continuation 14235292
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