IP Library › Granted Patent US 10,854,978
Granted Patent B2
US 10,854,978 · App. 16/251,552 · Granted Dec 1, 2020

Antenna apparatus and antenna module

Inventors: Dae Ki Lim (Suwon-si, KR); Ju Hyoung Park (Suwon-si, KR); Jeong Ki Ryoo (Suwon-si, KR); Nam Ki Kim (Suwon-si, KR); Myeong Woo Han (Suwon-si, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H01Q9/0414H01Q1/526H01Q19/005H01Q19/30
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Quick Facts
Patent No.
US 10,854,978
App. No.
16/251,552
Granted
Dec 1, 2020
Kind
B2
Abstract

An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.

Claims (38)

1. An antenna apparatus comprising:

a ground layer comprising a through-hole;

a feed via disposed to pass through the through-hole;

a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via;

a first coupling patch pattern disposed on the patch antenna pattern;

a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern;

a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern;

electrical connection structures disposed on the ground layer and configured to support the dielectric layer; and

grounding vias configured to electrically connect the electrical connection structures to the ground layer.

2. The antenna apparatus of claim 1 , wherein the dielectric constant of at least a portion of the space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the dielectric layer.

3. The antenna apparatus of claim 1 , wherein the dielectric layer comprises a cavity disposed between the first coupling patch pattern and the patch antenna pattern.

4. The antenna apparatus of claim 3 , wherein the first coupling patch pattern is disposed on the dielectric layer and is exposed on one surface of the dielectric layer, and

the second coupling patch pattern is disposed in the cavity.

5. The antenna apparatus of claim 4 , wherein a lateral length of the first coupling patch pattern is longer than a lateral length of the second coupling patch pattern, and the lateral length of the first coupling patch pattern is shorter than a lateral length of the cavity.

6. The antenna apparatus of claim 5 , wherein a lateral length of the patch antenna pattern is shorter than the lateral length of the second coupling patch pattern.

7. The antenna apparatus of claim 4 , further comprising an upper dielectric layer disposed on the dielectric layer and surrounding the first coupling patch pattern.

8. The antenna apparatus of claim 1 , further comprising a second dielectric layer disposed in at least a portion of a region between the ground layer and the patch antenna pattern,

wherein at least a portion of each of the grounding vias is disposed in the second dielectric layer, and

the electrical connection structures are disposed on the second dielectric layer.

9. The antenna apparatus of claim 8 , wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the dielectric layer.

10. The antenna apparatus of claim 1 , further comprising conductive array patterns arranged to surround the first coupling patch pattern or the second coupling patch pattern along a side boundary of the first coupling patch pattern or the second coupling patch pattern and electrically connected to the electrical connection structures.

11. The antenna apparatus of claim 10 , wherein the conductive array patterns includes:

first conductive array patterns disposed on a same level as the first coupling patch pattern;

second conductive array patterns electrically connected to the grounding vias; and

layout vias connecting the first conductive array patterns to the second conductive array patterns.

12. An electronic device comprising:

the antenna apparatus of 1 .

13. An antenna apparatus comprising:

a ground layer comprising a through-hole;

a feed via disposed to pass through the through-hole;

a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via;

a first coupling patch pattern disposed on the patch antenna pattern;

a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern;

a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern; and

conductive array patterns arranged to surround the first coupling patch pattern or the second coupling patch pattern along a side boundary of the first coupling patch pattern or the second coupling patch pattern and comprising at least a portion disposed in the dielectric layer.

14. The antenna apparatus of claim 13 , wherein the conductive array patterns include:

first and second conductive array patterns; and

layout vias connecting the first conductive array patterns to the second conductive array patterns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2019
From: LIM, DAE KI; PARK, JU HYOUNG; RYOO, JEONG KI; KIM, NAM KI; HAN, MYEONG WOO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 048058/0279 →
Priority Claims (2)
KR 10-2018-0046817 · Apr 23, 2018 · national
KR 10-2018-0093002 · Aug 9, 2018 · national
Continuity (1)
Related Publication 20190326672A1 · Oct 24, 2019