Electrostatic chuck device
An object is to provide an electrostatic chuck device having high heat resistance, which can be used even under high-temperature environment. An electrostatic chuck device includes: an electrostatic chuck section having a placing surface for placing a plate-shaped sample on one main surface thereof and an electrode for electrostatic adsorption; a temperature-controlling base section which is provided on the other side of the electrostatic chuck section in relation to the placing surface to cool the electrostatic chuck section; a heater element which is provided in a form of a layer between the electrostatic chuck section and the temperature-controlling base section; and a first adhesive layer which is provided between the heater element and the electrostatic chuck section to adhere the heater element and the electrostatic chuck section to each other, in which the first adhesive layer is made of inorganic glass or an inorganic material having a partially crystallized glass structure.
1. An electrostatic chuck device comprising:
an electrostatic chuck section comprising:
a placing plate having a placing surface for placing a plate-shaped sample on one main surface thereof;
a supporting plate integrated with the placing plate and supports the placing plate; and
an electrode for an electrostatic adsorption provided between the placing plate and the supporting plate;
a temperature-controlling base section which is provided on an other side of the electrostatic chuck section in relation to the placing surface to cool the electrostatic chuck section;
a heater element which is provided in a form of a layer between the electrostatic chuck section and the temperature-controlling base section; and
a first adhesive layer which is provided between the heater element and the electrostatic chuck section to adhere the heater element and the electrostatic chuck section to each other;
an inorganic ceramic membrane provided between the heater element and the temperature-controlling base section so that the heater element is embedded with the first adhesive layer and the inorganic ceramic membrane;
wherein the first adhesive layer is made of an inorganic glass or an inorganic material having a partially crystallized glass structure.
2. The electrostatic chuck device according to claim 1 , wherein the inorganic ceramic membrane is a thermally-sprayed ceramic coating.
3. The electrostatic chuck device according to claim 2 , wherein the thermally-sprayed ceramic coating is a thermally-sprayed coating of aluminum oxide or yttrium oxide.
4. The electrostatic chuck device according to claim 1 further comprising:
a second adhesive layer provided between the inorganic ceramic membrane and the temperature-controlling base section,
wherein the second adhesive layer comprises an organic adhesive agent.
5. The electrostatic chuck device according to claim 1 ,
wherein, when a coefficient of thermal expansion of the electrostatic chuck section is A, a coefficient of thermal expansion of the heater element is B, and a coefficient of thermal expansion of the first adhesive layer is C; then, there is a relationship among these coefficients: A<C<B or A>C>B.
6. The electrostatic chuck device according to claim 1 , wherein the first adhesive layer is a green sheet.
7. The electrostatic chuck device according to claim 1 ,
wherein, when a coefficient of thermal expansion of the heater element is B, a coefficient of thermal expansion of the first adhesive layer is C, and a coefficient of thermal expansion of the inorganic ceramic membrane is D; then there is a relationship among these coefficients: B<D<C or B>D>C.