IP Library › Granted Patent US 10,861,997
Granted Patent B2
US 10,861,997 · App. 16/222,542 · Granted Dec 8, 2020

Single photon avalanche gate sensor device

Inventor: Francois Roy (Seyssins, FR)
Assignee: STMicroelectronics (Crolles 2) SAS
H01L31/1136H01L27/1463H01L27/14605H01L27/14614H01L27/14643H01L31/022408H01L31/022475H01L27/1464
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Quick Facts
Patent No.
US 10,861,997
App. No.
16/222,542
Granted
Dec 8, 2020
Kind
B2
Abstract

A semiconductor substrate doped with a first doping type is positioned adjacent an insulated gate electrode that is biased by a gate voltage. A first region within the semiconductor substrate is doped with the first doping type and biased with a bias voltage. A second region within the semiconductor substrate is doped with a second doping type that is opposite the first doping type. Voltage application produces an electrostatic field within the semiconductor substrate causing the formation of a fully depleted region within the semiconductor substrate. The fully depleted region responds to absorption of a photon with an avalanche multiplication that produces charges that are collected at the first and second regions.

Claims (29)

1. A photosensor, comprising:

a first semiconductor layer doped with a first doping type;

a buried insulator layer over the first semiconductor layer;

a second semiconductor layer doped with the first doping type over the buried insulator layer;

an insulated gate electrode adjacent said second semiconductor layer;

wherein the first semiconductor layer and insulated gate electrode are configured to be biased by a voltage to produce an electrostatic field within the second semiconductor layer causing the formation of a depletion region within the second semiconductor layer, said depletion region responding to absorption of a photon with an avalanche multiplication.

2. The photosensor of claim 1 , further comprising:

a first region within the second semiconductor layer doped with the first doping type; and

a second region within the second semiconductor layer doped with a second doping type that is opposite the first doping type;

wherein the avalanche multiplication produces charges that are collected through the first and second regions.

3. The photosensor of claim 2 , wherein the first region is configured to be biased with a first bias voltage and the second region is configured to be biased with a second bias voltage.

4. The photosensor of claim 2 , wherein the second region extends completely through the second semiconductor layer to contact the buried insulator layer.

5. The photosensor of claim 1 , wherein the photon is received by passing through the first semiconductor layer.

6. The photosensor of claim 1 , wherein the photon is received by passing through the insulated gate electrode.

7. The photosensor of claim 6 , wherein a conductive layer of the insulated gate electrode is made of a transparent material.

8. The photosensor of claim 2 , wherein the charges are electrons.

9. The photosensor of claim 2 , wherein the charges are holes.

10. A photosensor, comprising:

a semiconductor on insulator (SOI) substrate including: a first semiconductor layer; a buried insulator layer in contact with a top of the first semiconductor layer; and a second semiconductor layer in contact with a top of the buried insulator layer;

an insulated gate electrode adjacent a top surface of said second semiconductor layer;

wherein the first semiconductor layer and insulated gate electrode are electrically connected to each other to receive a first voltage which produces an electrostatic field within the second semiconductor layer causing the formation of a depletion region within the second semiconductor layer; and

a doped region within the second semiconductor layer that is configured to collect charges generated by an avalanche multiplication produced in response to said depletion region absorbing a photon.

11. The photosensor of claim 10 , wherein the doped region extends completely through the second semiconductor layer to reach the buried insulator layer, and wherein the doped region is doped with a doping type opposite the second semiconductor layer.

12. The photosensor of claim 10 , wherein the doped region extends only partially through the second semiconductor layer, and wherein the doped region is doped with a doping type same as the second semiconductor layer.

13. The photosensor of claim 10 , wherein the photon is received by passing through the first semiconductor layer.

14. The photosensor of claim 10 , wherein the photon is received by passing through the insulated gate electrode.

15. The photosensor of claim 14 , wherein a conductive layer of the insulated gate electrode is made of a transparent material.

16. The photosensor of claim 10 , wherein the charges are electrons.

17. The photosensor of claim 10 , wherein the charges are holes.

Continuity (2)
Continuation 15945972 · Apr 5, 2018
Related Publication 20190312170A1 · Oct 10, 2019