Chromatic confocal area sensor
3D measurements of features on a workpiece, such as ball height, co-planarity, component thickness, or warpage, are determined. The system includes a broadband light source, a microlens array, a tunable color filter, a lens system, and a detector. The microlens array can focus a light beam to points in a focal plane of the microlens array. The tunable color filter can narrow the light beam to a band at a central wavelength. The lens system can provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system.
1. A system comprising:
a broadband light source that generates a light beam;
a stage configured to hold a workpiece;
a microlens array positioned in a path of the light beam, wherein the microlens array focuses the light beam to a plurality of points in a focal plane of the microlens array, and wherein the microlens array is configured as a spatial filter for the light beam that is reflected from the workpiece on the stage thereby only passing the light beam that is in focus at the workpiece on the stage;
a tunable color filter positioned in the path of the light beam, wherein the tunable color filter is configured to narrow the light beam to a band at a central wavelength;
a lens system positioned to image the plurality of points onto the workpiece using the light beam, wherein the lens system is configured to provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system; and
a detector positioned to receive the light beam from the workpiece on the stage, wherein the light beam reflected from the workpiece on the stage is directed through the microlens array before being received by the detector.
2. The system of claim 1 , further comprising a collimating lens positioned in the path of the light beam between the tunable color filter and the microlens array, wherein the collimating lens is configured to collimate the light beam and direct the light beam at the microlens array.
3. The system of claim 2 , wherein the tunable color filter is disposed between the microlens array and the lens system along the path of the light beam.
4. The system of claim 1 , wherein the detector is a greyscale area scan camera.
5. The system of claim 1 , wherein the lens system is an objective lens.
6. The system of claim 1 , further comprising a beam splitter positioned in the path of the light beam between the tunable color filter and the lens system.
7. The system of claim 1 , further comprising a tube lens positioned in the path of the light beam between the microlens array and the lens system.
8. The system of claim 1 , wherein the tunable color filter is disposed between the broadband light source and the microlens array.
9. The system of claim 1 , wherein the tunable color filter is disposed between the microlens array and the detector.
10. The system of claim 1 , wherein a plurality of the tunable color filter is positioned in the path of the light beam.
11. The system of claim 1 , wherein the tunable color filter is a liquid crystal tunable filter, an acousto optical tunable filter, or a tunable Fabry Perot etalon.
12. The system of claim 1 , further comprising a processor in electronic communication with the detector, wherein the processor is configured to determine 3D measurements of features on the workpiece.
13. A method comprising:
generating a light beam using a broadband light source;
focusing, using a microlens array, the light beam into a plurality of points in a focal plane of the microlens array, wherein the microlens array is configured as a spatial filter;
narrowing the light beam to a band at a central wavelength using a tunable color filter;
imaging a plurality of points onto a workpiece using a lens system, wherein the lens system is configured to provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system;
passing the light beam reflected from the workpiece that is in focus at the workpiece using the microlens array; and
receiving the light beam reflected from the workpiece at a detector.
14. The method of claim 13 , further comprising determining 3D measurements of features on the workpiece using a processor.
15. The method of claim 14 , further comprising:
sweeping a narrow band from a low wavelength to a high wavelength; and
determining a topography of the workpiece using the processor.
16. The method of claim 14 , wherein the 3D measurements include one or more of ball height, co-planarity, component thickness, and warpage.
17. The method of claim 14 , further comprising skipping part of the workpiece during the determining.
18. The method of claim 13 , wherein only one or more features from the workpiece located at a selected Z-level are detected by the detector.