IP Library Granted Patent US 10,866,655
Granted Patent B2
US 10,866,655 · App. 16/200,685 · Granted Dec 15, 2020

Touchpad module

Inventor: Naoki Kanai (Ueda, JP)
Assignees: NIDEC CORPORATION; NIDEC SEIMITSU CORPORATION
G06F3/03547G06F1/169G06F3/016
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Quick Facts
Patent No.
US 10,866,655
App. No.
16/200,685
Granted
Dec 15, 2020
Kind
B2
Abstract

A touchpad module includes an outer frame, a support disposed inside the outer frame, a spring that connects the outer frame and the support to each other, a substrate fixed to and supported by the support, and a vibration motor mounted on the substrate, in which a vibration direction of the vibration motor and an urging direction of the spring coincide in a lateral direction.

Claims (26)

1. A touchpad module for vibrating a touchpad, the touchpad module comprising:

an outer frame;

a support inside the outer frame;

a spring that connects the outer frame and the support to each other;

a substrate fixed to and supported by the support; and

a vibration motor mounted on the substrate; wherein

a vibration direction of the vibration motor and an urging direction of the spring coincide in a lateral direction;

the spring includes a bent portion; and

the outer frame, the support, and the spring are defined as a single monolithic member punched out from a single flat plate.

2. The touchpad module according to claim 1 , wherein a vibration frequency of the vibration motor coincides with a resonance frequency of a vibration system including the support, the substrate, and the spring.

3. The touchpad module according to claim 1 , wherein the support includes a through hole in which the vibration motor and an electronic component mounted on the substrate are provided.

4. The touchpad module according to claim 3 , wherein

the through hole includes a vibration motor avoidance hole in which the vibration motor is disposed, and an electronic component avoidance hole in which the electronic component is provided; and

the vibration motor avoidance hole and the electronic component avoidance hole are separate from each other.

5. The touchpad module according to claim 1 , wherein the substrate is fixed to the support with an adhesive tape.

6. The touchpad module according to claim 1 , wherein the vibration motor is located at a center of the support.

7. The touchpad module according to claim 6 , wherein an electronic component mounted on the substrate is provided on each side of the vibration motor in a lateral direction.

8. The touchpad module according to claim 1 , wherein the outer frame is fixed to a casing of a device including the touchpad via a damper.

9. The touchpad module according to claim 8 , wherein the outer frame is fixed via the damper to a holder screwed to the casing.

10. The touchpad module according to claim 9 , wherein

the damper is between an outer side surface portion of the outer frame and an inner side surface of the holder; and

another damper separate from the damper is interposed in a top-bottom direction between an upper surface of the outer frame portion and the casing.

11. The touchpad module according to claim 1 , wherein the vibration motor is a lateral linear vibration motor including a substrate and a vibrating body vibrating in a direction parallel or substantially parallel to the substrate.

12. A device comprising:

the touchpad module according to claim 1 ; and

a touchpad.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2018
From: KANAI, NAOKI
To: NIDEC CORPORATION; NIDEC SEIMITSU CORPORATION
Reel/Frame 047587/0409 →
Priority Claims (1)
JP 2017-229276 · Nov 29, 2017 · national
Continuity (1)
Related Publication 20190163294A1 · May 30, 2019
Cited By (2)
US 12,494,115 US 12,726,097