Apparatus and method for treating substrate
The substrate treating apparatus includes a process chamber having a treatment space in the interior thereof, a support unit disposed in the process chamber to support a substrate, a gas supply unit configured to supply a process gas into the process chamber, and a plasma generating unit configured to generate plasma from the process gas. The plasma generating unit includes an upper electrode disposed on the substrate, a lower electrode disposed under the substrate to be vertically opposite to the upper electrode, and three high frequency power sources configured to apply high frequency power to the lower electrode. The three high frequency power sources include a first frequency power source and a second frequency power source having frequencies of 10 MHz or less, and a third frequency power source having a frequency of 10 MHz or more.
1. A substrate treating apparatus comprising:
a process chamber having a treatment space in the interior thereof;
a support unit disposed in the process chamber to support a substrate;
a gas supply unit configured to supply a process gas into the process chamber;
a lower cover located at a lower end of the support unit, wherein an interior space of the lower cover between the support unit and the lower cover is provided with air, wherein the lower cover comprises more than two connecting members connecting an outer surface of the lower cover and an inner wall of the process chamber to support and secure the support unit in the interior of the process chamber, wherein the more than two connecting members are separate members from the lower cover, and wherein a bottom surface of the lower cover is formed of a metallic material;
a plate located between the support unit and the lower cover, and configured to cover and seal an upper surface of the lower cover, wherein the plate includes an insulator, wherein sectional areas of the support unit, the plate and the lower cover are the same; and
a plasma generating unit configured to generate plasma from the process gas,
wherein the plasma generating unit includes:
an upper electrode disposed above the substrate;
a lower electrode disposed under the substrate to be vertically opposite to the upper electrode; and
three high frequency power sources configured to apply high frequency power to the lower electrode,
wherein the three high frequency power sources include:
a first frequency power source and a second frequency power source having frequencies of 10 MHz or less; and
a third frequency power source having a frequency of 60 MHz.
2. The substrate treating apparatus of claim 1 , wherein the first frequency power source and the second frequency power source have frequencies ranging from 50 KHz to 10 MHz.
3. The substrate treating apparatus of claim 2 , wherein the frequency of the first frequency power source is 400 KHz or 2 MHz, and the frequency of the second frequency power source is 9.8 MHz.
4. The substrate treating apparatus of claim 1 , wherein the high frequency power applied by the first frequency power source and the second frequency power source increases ion energy input to the substrate, and
wherein the high frequency power applied by the third frequency power source increases a density of plasma.
5. The substrate treating apparatus of claim 1 , wherein the upper electrode is connected to a DC power source or a reference potential.
6. The substrate treating apparatus of claim 1 , wherein the upper electrode is connected to a fourth frequency power source having a frequency ranging from 10 MHz to 100 MHz.
7. The substrate treating apparatus of claim 2 , further comprising:
a pulse supply configured to apply an on/off pulse to the three high frequency power sources.
8. The substrate treating apparatus of claim 7 , wherein the plasma generating unit independently controls pulse frequencies of the three high frequency power sources.
9. The substrate treating apparatus of claim 1 , wherein the plasma generating unite further includes a matching unit electrically connected to the first, second and third frequency power sources and is configured to match frequency power of different intensities to apply the frequency power to the lower electrode.