Electroconductive substrate, electronic device and display device
An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.
1. An electroconductive substrate, comprising:
a base material;
a foundation layer which is disposed on the base material and contains a catalyst and a resin;
a trench formation layer disposed on the foundation layer; and
an electroconductive pattern layer including metal plating, wherein:
a trench including a bottom surface to which the foundation layer is exposed, and a lateral surface which includes a surface of the trench formation layer, is formed;
the trench is at least partially filled with the electroconductive pattern layer;
the catalyst is dispersed in the resin, as catalyst particles;
the foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles containing a metal configuring the electroconductive pattern layer; and
a gap is formed between at least a part of a lateral surface of the electroconductive pattern layer and the lateral surface of the trench.
2. The electroconductive substrate according to claim 1 ,
wherein a ratio of a thickness of the mixed region to a thickness of the foundation layer is 0.1 to 0.9.
3. The electroconductive substrate according to claim 1 ,
wherein a width of the electroconductive pattern layer is 0.3 μm to 5.0 μm, and a ratio of the thickness of the electroconductive pattern layer to the width of the electroconductive pattern layer is 0.1 to 10.0.
4. The electroconductive substrate according to claim 1 ,
wherein surface roughness Ra of a surface of the electroconductive pattern layer on a side opposite to the bottom surface of the trench is less than or equal to 100 nm.
5. The electroconductive substrate according to claim 1 ,
wherein the electroconductive pattern layer includes a blackened surface which configures a surface of the electroconductive pattern layer including a surface on a side opposite to the bottom surface of the trench, and surface roughness Ra of the blackened surface is 15 nm to 60 nm.
6. The electroconductive substrate according to claim 1 , further comprising:
a protective film covering at least a part of a surface of the trench formation layer and the electroconductive pattern layer on a side opposite to the base material,
wherein a refractive index of the protective film is greater than 1.0, and is less than a refractive index of the trench formation layer.
7. The electroconductive substrate according to claim 1 ,
wherein the electroconductive pattern layer forms a mesh-like pattern.
8. An electronic device, comprising:
the electroconductive substrate according to claim 1 ; and
an electronic component mounted on the electroconductive substrate.
9. The electronic device according to claim 8 , further comprising:
a connection portion disposed on the electroconductive pattern layer of the electroconductive substrate,
wherein the electronic component is connected to the electroconductive substrate through the connection portion.
10. The electronic device according to claim 8 , further comprising:
an adhesion layer disposed on the electroconductive pattern layer of the electroconductive substrate;
an insulating layer which is disposed on the trench formation layer and the adhesion layer, covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed;
a UBM layer disposed on a surface of the adhesion layer which is exposed into the opening portion of the insulating layer; and
a connection portion disposed on the UBM layer,
wherein the electronic component is connected to the electroconductive substrate through the connection portion, the UBM layer, and the adhesion layer.
11. A display device, comprising:
the electroconductive substrate according to claim 1 ; and
a light emitting element mounted on the electroconductive substrate.
12. The display device according to claim 11 , further comprising:
a connection portion disposed on the electroconductive pattern layer of the electroconductive substrate,
wherein the light emitting element is connected to the electroconductive substrate through the connection portion.
13. The display device according to claim 11 , further comprising:
an adhesion layer disposed on the electroconductive pattern layer of the electroconductive substrate;
an insulating layer which is disposed on the trench formation layer and the adhesion layer, covers a surface of the trench formation layer on a side opposite to the foundation layer, and includes an opening portion to which a part of the adhesion layer is exposed;
a UBM layer disposed on a surface of the adhesion layer which is exposed into the opening portion of the insulating layer; and
a connection portion disposed on the UBM layer,
wherein the light emitting element is connected to the electroconductive substrate through the connection portion, the UBM layer, and the adhesion layer.