IP Library Granted Patent US 10,868,097
Granted Patent B2
US 10,868,097 · App. 15/925,603 · Granted Dec 15, 2020

Organic light emitting diode display and manufacturing method thereof

Inventor: Tae Uk Kim (Seoul, KR)
Assignee: Samsung Display Co., Ltd.
H01L27/3265H01L27/1225H01L27/1244H01L27/1255H01L27/3248H01L27/3262H01L27/3276H01L29/24H01L29/66757H01L29/7869H01L29/78675
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,868,097
App. No.
15/925,603
Granted
Dec 15, 2020
Kind
B2
Abstract

An organic light emitting diode display includes: a substrate; a scan line formed over the substrate and transmitting a scan signal; a data line crossing the scan line and transmitting a data voltage; a driving voltage line crossing the scan line and transmitting a driving voltage; a switching transistor connected to the scan line and the data line; a driving transistor connected to the switching transistor; a driving connection member connected to a driving gate electrode of the driving transistor; a storage capacitor including a first storage electrode and a second storage electrode; a pixel electrode electrically connected to the driving transistor; and a contact hole connecting the first storage electrode and the driving connection member. The second storage electrode may include a cut-out by a curved edge at least partially surrounding the contact hole, and the pixel electrode may be formed not to overlap the cut-out.

Claims (21)

1. A method of making an organic light emitting diode display, the method comprising:

forming a semiconductor layer over a substrate;

forming a first insulation layer over the semiconductor layer;

forming a first electrically conductive layer portion over the first insulation layer, thereby forming a first thin film transistor comprising the semiconductor layer and the first electrically conductive layer portion which is configured to function as a gate electrode;

forming a second insulation layer over the first electrically conductive layer portion;

forming a second electrically conductive layer portion over the second insulation layer, wherein the first and second electrically conductive layer portions overlap each other, thereby forming a capacitor, wherein the first electrically conductive layer portion comprises a first capacitor electrode of the capacitor, wherein the second electrically conductive layer portion comprises a second capacitor electrode of the capacitor;

forming a third electrically conductive layer portion over the second insulation layer;

forming a via in the second insulation layer;

forming a third insulation layer over the second and third electrically conductive layer portions; and

forming a pixel electrode over the third insulation layer,

wherein the second electrically conductive layer portion comprises a cut-out defined by a curved edge thereof, which partly surrounds the via when viewed in a viewing direction perpendicular to a major surface of the substrate,

wherein the via is formed at a portion of the second insulation layer that is exposed by the cut-out,

wherein the first electrically conductive layer portion and the third electrically conductive layer portion are connected through the via,

wherein the third electrically conductive layer portion and the cut-out are spaced apart from each other in the viewing direction, and

wherein the pixel electrode overlaps the second electrically conductive layer portion, but does not overlap the cut-out and the third electrically conductive layer portion when viewed in the viewing direction.

2. The method of claim 1 , wherein the cut-out is an indent or a hole when viewed in the viewing direction.

3. The method of claim 1 , further comprising forming a light emission layer over the pixel electrode, wherein the light emission layer overlaps the second electrically conductive layer portion, but does not overlap the cut-out when viewed in the viewing direction.

4. The method of claim 1 , wherein forming the second electrically conductive layer comprises patterning an electrically conductive material layer formed over the second insulation layer to form an indent to form the cut-out.

5. The method of claim 1 , wherein the curved edge partially surrounds the via at three sides when viewed in the viewing direction perpendicular to the major surface of the substrate.

6. The method of claim 1 , wherein the pixel electrode is spaced from inner edges of the curved edge that at least partially surrounds the via in a direction parallel to the major surface of the substrate.

7. The method of claim 1 , wherein the pixel electrode does not overlap the cut-out when viewed in the viewing direction, while the first electrically conductive layer does.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2018
From: KIM, TAE UK
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 045321/0703 →
Priority Claims (1)
KR 10-2015-0060539 · Apr 29, 2015 · national
Continuity (2)
Division 15044675 · Feb 16, 2016
Related Publication 20180212012A1 · Jul 26, 2018