High speed wire end connector and manufacturing method thereof
A high speed wire end connector manufacturing method includes the following steps. First, a cable is soldered to a printed circuit board, and then an inner film is formed to cover a portion of the cable and a portion of the printed circuit board by an insert molding process. Another portion of the printed circuit board is passed through a guide hole of an outer casing, and a molded bonding layer is formed by an outer molding process to bond to the outer casing and the inner film. In addition, a metal spring latch is fixed on the outer casing. In addition, a high speed wire end connector is also disclosed herein.
1. A high speed wire end connector, comprising:
a printed circuit board;
a cable soldering on the printed circuit board;
an inner film covering a portion of the cable and a portion of the printed circuit board;
an outer casing fixing the printed circuit board, the cable and the inner film, wherein another portion of the printed circuit board passes through a guide hole of the outer casing; and
a molded bonding layer bonding to the outer casing and the inner film, wherein the outer casing further comprises a plurality of adhesive lugs, and the molded bonding layer further comprises a plurality of adhesive grooves to bond to corresponding adhesive lugs, wherein the adhesive lugs further comprise openings and the molded bonding layer further comprises a plurality of adhesive bumps to bond to corresponding openings, wherein the molded bonding layer further comprises at least one positioning hole to expose the inner film.
2. The high speed wire end connector of claim 1 , further comprising a metal spring latch fixing on the outer casing.
3. The high speed wire end connector of claim 2 , wherein the outer casing further comprises a fixing tongue and the metal spring latch is fixed on the fixing tongue.
4. The high speed wire end connector of claim 3 , wherein the outer casing further comprises a U-shaped protection, and the U-shaped protection and the fixing tongue surround the printed circuit board.
5. The high speed wire end connector of claim 4 , wherein the outer casing further comprises a plurality of limit protrusions to limit the inner film in the outer casing.
6. The high speed wire end connector of claim 5 , wherein the molded bonding layer comprises a plurality of adhesive grooves to bond to corresponding limit protrusions.
7. The high speed wire end connector of claim 6 , wherein the outer casing further comprises a plurality of adhesive recesses formed between the limit protrusions to bond to adhesive bumps of the molded bonding layer.
8. The high speed wire end connector of claim 7 , wherein the limit protrusions comprise at least one first limit protrusion and at least one second limit protrusion corresponding to a first surface of the inner film, and the first surface of the inner film is parallel to a surface of the printed circuit board.
9. The high speed wire end connector of claim 8 , wherein the limit protrusions further comprise a third limit protrusion corresponding to a second surface of the inner film, and the second surface is perpendicular to the surface of the printed circuit board.
10. The high speed wire end connector of claim 9 , wherein the limit protrusions further comprise at least one fourth limit protrusion corresponding to a third surface of the inner film, and the third surface is perpendicular to the surface of the printed circuit board and the second surface.
11. The high speed wire end connector of claim 1 , wherein the outer casing further comprises a sliding channel to allow the printed circuit board sliding into the guide hole of the outer casing.