Circuit board heat dissipation assembly
A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.
1. A circuit board heat dissipation assembly, comprising:
a circuit board, including a front side and a rear side, wherein the front side has at least one heat generating area;
a heat sink, disposed in the heat generating area;
a metal back plate, disposed at a spacing from the rear side of the circuit board;
a heat pipe, including a first end, a bend segment, and a second end, wherein the first end is connected to the heat sink, the second end is in contact with the metal back plate, and the bend segment connects the first end and the second end at a side edge of the circuit board;
a pressing member, including a fixed portion and a pressing portion extending from the fixed portion, wherein the pressing member and the second end of the heat pipe are located between the metal back plate and the circuit board, the fixed portion is configured to be fixed on the metal back plate, and the pressing portion is configured to press the second end; and
a bolt, configured to pass through the metal back plate from an outer side surface of the metal back plate and be screwed into the fixed portion of the pressing member, so as to fix the fixed portion to the metal back plate;
wherein the circuit board includes a notched groove located at the side edge of the circuit board, the notched groove is open at the side edge and extends toward the pressing member, and the bend segment passes through the notched groove.
2. The circuit board heat dissipation assembly as claimed in claim 1 , further comprising a plurality of connecting columns, wherein the circuit board and the metal back plate are connected through the plurality of connecting columns.
3. The circuit board heat dissipation assembly as claimed in claim 1 , wherein the metal back plate covers the entire rear side of the circuit board.
4. The circuit board heat dissipation assembly as claimed in claim 1 , wherein the metal back plate covers a part of the rear side of the circuit board.
5. The circuit board heat dissipation assembly as claimed in claim 4 , wherein a projection of the metal back plate on the circuit board overlaps a projection of the heat sink on the circuit board.
6. The circuit board heat dissipation assembly as claimed in claim 1 , wherein the second end is flat and includes a first contact surface and a second contact surface respectively in contact with the pressing member and the metal back plate.
7. The circuit board heat dissipation assembly as claimed in claim 6 , wherein a heat-conducting medium is disposed between the first contact surface and the pressing member, and/or a heat-conducting medium is disposed between the second contact surface and the metal back plate.
8. The circuit board heat dissipation assembly as claimed in claim 1 , wherein the pressing member and the second end are located between the metal back plate and the circuit board.
9. The circuit board heat dissipation assembly as claimed in claim 1 , wherein a thickness of the fixed portion is greater than the thickness of the pressing portion, a pressing space exists between the pressing portion and the metal back plate, and the second end is located in the pressing space.