Multilayer ceramic electronic component and method of manufacturing the same
A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes which face each other with the dielectric layer interposed therebetween. The first and second internal electrodes include a conductive metal and an additive. In a cross-section of the ceramic body in the length-thickness (L-T) plane, a ratio of content of the additive in the first and second internal electrodes in upper and lower portions of the ceramic body to a content of the additive in the first and second internal electrodes in a central portion of the ceramic body is around 0.63 to around 1.03.
1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer and first and second internal electrodes which face each other with the dielectric layer interposed therebetween, the first and second internal electrodes including a conductive metal and an additive,
wherein, in a cross-section of the ceramic body in the length-thickness plane, an amount of the additive in the first and second internal electrodes in upper and lower portions of the ceramic body is different than an amount of the additive in the first and second internal electrodes in a central portion of the ceramic body.
2. The multilayer ceramic electronic component of claim 1 , wherein a ratio of a content of the additive in the first and second internal electrodes to a content of the conductive metal is 0.5% or higher.
3. The multilayer ceramic electronic component of claim 2 , wherein the ratio of the content of the additive in the first and second internal electrodes to the content of the conductive metal is around 0.5% to around 3.0%.
4. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes disposed in the central portion of the ceramic body occupy an area around 40% to 60% of area occupied by all the first and second internal electrodes in the ceramic body.
5. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes disposed in the upper and lower portions of the ceramic body occupy an area around 10% or less than an area occupied by all the first and second internal electrodes from an uppermost internal electrode to a lowermost internal electrode.
6. The multilayer ceramic electronic component of claim 1 , wherein a thickness Te of each of the first and second internal electrodes satisfies the equation 0.1 μm ≤Te≤0.5 μm.
7. The multilayer ceramic electronic component of claim 1 , wherein the additive comprises a ceramic material.
8. The multilayer ceramic electronic component of claim 1 , wherein, in the cross-section of the ceramic body in the length-thickness plane, a ratio of a content of the additive in the first and second internal electrodes in the upper and lower portions of the ceramic body to a content of the additive in the first and second internal electrodes in the central portion of the ceramic body is around 0.63 to around 1.03.
9. A method of manufacturing a multilayer ceramic electronic component, comprising:
forming a ceramic green sheet;
forming, on the ceramic green sheet, an internal electrode pattern using a conductive paste, the conductive paste including a conductive metal, an additive, and sulfur (S) of 500 ppm or less;
forming a ceramic laminate by layering a plurality of ceramic green sheets, each including the internal electrode pattern; and
forming a ceramic body including a plurality of dielectric layers and a plurality of internal electrodes by sintering the ceramic laminate,
wherein, in a cross-section of the ceramic body taken in a length-thickness plane, an amount of the additive in internal electrodes of the plurality of internal electrodes in upper and lower portions of the ceramic body is different than an amount of the additive in internal electrodes in a central portion of the ceramic body.
10. The method of claim 9 , wherein a ratio of a content of the additive in the internal electrodes to a content of the conductive metal is around 0.5% or higher.
11. The method of claim 10 , wherein the ratio of the content of the additive in the internal electrodes to the content of the conductive metal is around 0.5% to around 3.0%.
12. The method of claim 9 , wherein the internal electrodes in the central portion of the ceramic body occupies an area of around 40% to around 60% of the entire area occupied by the plurality of internal electrodes.
13. The method of claim 9 , wherein the internal electrodes in the upper and lower portions of the ceramic body occupy an area of around 10% or less of the entire area occupied by the plurality of internal electrodes from an uppermost internal electrode to a lowermost internal electrode.
14. The method of claim 9 , wherein a thickness Te of each of the internal electrodes satisfies the equation 0.1 μm ≤Te≤0.5 μm.
15. The method of claim 9 , wherein the additive comprises a ceramic material.
16. The method of claim 9 , wherein, in the cross-section of the ceramic body taken in the length-thickness plane, a ratio of a content of the additive in the internal electrodes of the plurality of internal electrodes in the upper and lower portions of the ceramic body to a content of the additive in the internal electrodes in the central portion of the ceramic body is around 0.63 to around 1.03.