IP Library › Granted Patent US 10,878,843
Granted Patent B2
US 10,878,843 · App. 16/563,060 · Granted Dec 29, 2020

Head suspension assembly for disk device and including damper

Inventor: Kenichiro Aoki (Machida Tokyo, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
G11B5/4833G11B5/483G11B5/486G11B5/4853G11B5/4886G11B5/5565
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Quick Facts
Patent No.
US 10,878,843
App. No.
16/563,060
Granted
Dec 29, 2020
Kind
B2
Abstract

According to one embodiment, a head suspension assembly includes a support plate having a proximal end and a distal end, a wiring member on the support plate and including a metal plate and a wiring board laid on the metal plate, the metal plate including a first joined portion joined to the support plate close to the distal end and a second joined portion joined to the support plate and located on a proximal end side of the support plate, a head mounted on the wiring member, an extendable piezoelectric element mounted on the wiring member, and a damper including a viscoelastic layer and a constraint layer stacked on the viscoelastic layer and attached to the support plate to cover the first joined portion and the second joined portion.

Claims (55)

1. A head suspension assembly comprising:

a support plate having a first side, a second side, a proximal end and a distal end;

a wiring member placed on the first side of the support plate and including a metal plate and a wiring board laid on the metal plate, the metal plate including a first joined portion joined to the support plate close to the distal end and a second joined portion joined to the support plate and located on a proximal end side of the support plate with respect to the first joined portion;

a head mounted on the wiring member;

an extendable piezoelectric element mounted on the wiring member; and

a damper including a viscoelastic layer and a constraint layer stacked on the viscoelastic layer and attached to the second side of the support plate to overlap the first joined portion and the second joined portion.

2. The head suspension assembly of claim 1 , wherein the viscoelastic layer of the damper includes two or more types of viscoelastic layers having different damping characteristics.

3. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the first viscoelastic layer is stuck on the second side of the support plate to overlap the first joined portion and the second joined portion, the constraint layer is stacked on the first viscoelastic layer, and the second viscoelastic layer is stacked on the constraint layer.

4. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the second viscoelastic layer is stuck on the second side of the support plate to overlap the first joined portion and the second joined portion, the constraint layer is stacked on the second viscoelastic layer, and the first viscoelastic layer is stacked on the constraint layer.

5. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the first viscoelastic layer is stuck on the support plate and placed on the proximal end side of the support plate, the second viscoelastic layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the first viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer.

6. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the second viscoelastic layer is stuck on the support plate and placed on the proximal end side of the support plate, the first viscoelastic layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the second viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer.

7. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first layer stuck on the support plate and a second layer stacked on the first layer with the constraint layer therebetween;

the first layer and the second layer each include a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature;

the second viscoelastic layer of the first layer is stuck on the support plate and placed on the proximal end side of the support plate, the first viscoelastic layer of the first layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the second viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer; and

the first viscoelastic layer of the second layer is stacked on the constraint layer and placed on the proximal end side of the support plate, and the second viscoelastic layer of the second layer is stacked on the constraint layer and placed on the distal end side of the support plate with respect to the first viscoelastic layer.

8. The head suspension assembly of claim 1 , wherein:

the viscoelastic layer of the damper includes a first layer stuck on the support plate and a second layer stacked on the first layer with the constraint layer therebetween;

the first layer and the second layer each include a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature;

the first viscoelastic layer of the first layer is stuck on the support plate and placed on the proximal end side of the support plate, the second viscoelastic layer of the first layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the first viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer; and

the second viscoelastic layer of the second layer is stacked on the constraint layer and placed on the proximal end side of the support plate, and the first viscoelastic layer of the second layer is stacked on the constraint layer and placed on the distal end side of the support plate with respect to the second viscoelastic layer.

9. A disk device comprising:

a disk-shaped recording medium including a recording layer; and

the head suspension assembly of claim 1 , which supports a magnetic head.

10. The disk device of claim 9 , wherein the viscoelastic layer of the damper includes two or more types of viscoelastic layers having different damping characteristics.

11. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the first viscoelastic layer is stuck on the support plate to overlap the first joined portion and the second joined portion, the constraint layer is stacked on the first viscoelastic layer, and the second viscoelastic layer is stacked on the constraint layer.

12. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the second viscoelastic layer is stuck on the support plate to overlap the first joined portion and the second joined portion, the constraint layer is stacked on the second viscoelastic layer, and the first viscoelastic layer is stacked on the constraint layer.

13. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the first viscoelastic layer is stuck on the support plate and placed on the proximal end side of the support plate, the second viscoelastic layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the first viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer.

14. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature; and

the second viscoelastic layer is stuck on the support plate and placed on the proximal end side of the support plate, the first viscoelastic layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the second viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer.

15. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first layer stuck on the support plate and a second layer stacked on the first layer with the constraint layer therebetween;

the first layer and the second layer each have a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature;

the second viscoelastic layer of the first layer is stuck on the support plate and placed on the proximal end side of the support plate, the first viscoelastic layer of the first layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the second viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer; and

the first viscoelastic layer of the second layer is stacked on the constraint layer and placed on the proximal end side of the support plate, and the second viscoelastic layer of the second layer is stacked on the constraint layer and placed on the distal end side of the support plate with respect to the first viscoelastic layer.

16. The disk device of claim 9 , wherein:

the viscoelastic layer of the damper includes a first layer stuck on the support plate and a second layer stacked on the first layer with the constraint layer therebetween;

the first layer and the second layer each have a first viscoelastic layer whose damping characteristics are good at high temperature and a second viscoelastic layer whose damping characteristics are good at low temperature;

the first viscoelastic layer of the first layer is stuck on the support plate and placed on the proximal end side of the support plate, the second viscoelastic layer of the first layer is stuck on the support plate and placed on a distal end side of the support plate with respect to the first viscoelastic layer, the first viscoelastic layer and the second viscoelastic layer overlap the first joined portion and the second joined portion, and the constraint layer is stacked on the first viscoelastic layer and the second viscoelastic layer; and

the second viscoelastic layer of the second layer is stacked on the constraint layer and placed on the proximal end side of the support plate, and the first viscoelastic layer of the second layer is stacked on the constraint layer and placed on the distal end side of the support plate with respect to the second viscoelastic layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2019
From: AOKI, KENICHIRO
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 050644/0280 →
Priority Claims (1)
JP 2019-048937 · Mar 15, 2019 · national
Continuity (1)
Related Publication 20200294539A1 · Sep 17, 2020
Cited By (1)
US 12,198,736