Needle cell trench MOSFET

1. A power semiconductor die having a semiconductor body coupled to a first load terminal and a second load terminal of the power semiconductor die and configured to conduct a load current between the load terminals, and comprising:

a control trench structure for controlling the load current, the control trench structure extending into the semiconductor body along a vertical direction and arranged in accordance with a horizontal grid pattern having a plurality of grid openings; and

a plurality of power cells, each power cell being, in a horizontal cross-section, at least partially arranged in a respective one of the plurality of grid openings, wherein at least one of the power cells comprises:

a section of a drift zone of a first conductivity type, a section of a channel zone of a second conductivity type and a section of a source zone of the first conductivity type, wherein the channel zone section is electrically connected to the first load terminal and isolates the source zone section from the drift zone section;

a control section with at least one control electrode section in the control trench structure; and

a columnar field plate trench extending into the semiconductor body along the vertical direction and including a field plate electrode electrically coupled to the first load terminal, the columnar field plate trench having a deep portion below the channel zone section and a proximal portion above the deep portion, the proximal portion vertically overlapping with the channel zone section, wherein a deep horizontal width of the deep portion amounts to at least 110% of a proximal horizontal width of the proximal portion.

2. The power semiconductor die of claim 1 , wherein, at least in a subportion of the proximal portion, a rate of change of the proximal horizontal width with respect to the vertical direction is either zero or negative.

3. The power semiconductor die of claim 1 , wherein a total vertical extension of the deep portion amounts to at least 10% of a total vertical extension of the columnar field plate trench.

4. The power semiconductor die of claim 3 , wherein a rate of change of the deep horizontal width with respect to the vertical direction is either zero or positive.

5. The power semiconductor die of claim 1 , wherein the field plate electrode extends into each of the proximal portion and the deep portion.

6. The power semiconductor die of claim 1 , wherein the columnar field plate trench includes a trench insulator that electrically isolates the field plate electrode from the semiconductor body.

7. The power semiconductor die of claim 6 , wherein at least one of a horizontal width of the field plate electrode and a horizontal thickness of the field insulator increases along the vertical direction.

8. The power semiconductor die of claim 1 , wherein the field plate electrode has a maximum width in a section that forms a part of the deep portion of the columnar field plate trench.

9. The power semiconductor die of claim 1 , wherein the field plate electrode exhibits a void volume section.

10. The power semiconductor die of claim 9 , wherein the void volume section extends into the deep portion and does not extend into the proximal portion.

11. The power semiconductor die of claim 1 , wherein the deep portion forms, at least partially, a distal portion that terminates the columnar field plate trench along the vertical direction, wherein the distal portion includes no more than 30% of the total extension of the columnar field plate trench.

12. The power semiconductor die of claim 1 , wherein the horizontal width of each columnar field plate trench changes in accordance with a constant rate of change along the vertical direction for at least 40% of the total vertical extension of the respective columnar field plate trench.

13. The power semiconductor die of claim 1 , wherein the horizontal width of each columnar field plate trench increases for at least 70% of the total vertical extension of the respective columnar field plate trench.

14. The power semiconductor die of claim 1 , wherein the horizontal width of each columnar field plate trench remains substantially constant along the vertical direction for at least 70% of the total vertical extension of the respective columnar field plate trench.

15. The power semiconductor die of claim 1 , wherein an increase of at least 10% of the horizontal width of each columnar field plate trench occurs along no more than 30% of the total vertical extension of the respective columnar field plate trench.

16. The power semiconductor die of claim 15 , wherein said no more than 30% of the total vertical extension of the respective columnar field plate trench forms a part of the deepest part of the respective columnar field plate trench.

17. The power semiconductor die of claim 1 , wherein each grid opening exhibits a maximal horizontal extension of no more than 1 μm.

18. A power semiconductor die having a semiconductor body coupled to a first load terminal and a second load terminal of the power semiconductor die and configured to conduct a load current between the load terminals, and comprising:

a control trench structure for controlling the load current, the control trench structure extending into the semiconductor body along a vertical direction and arranged in accordance with a horizontal grid pattern having a plurality of grid openings; and

a plurality of power cells, each power cell being, in a horizontal cross-section, at least partially arranged in a respective one of the plurality of grid openings, and comprising:

a section of a drift zone of a first conductivity type, a section of a channel zone of a second conductivity type and a section of a source zone of the first conductivity type, wherein the channel zone section is electrically connected to the first load terminal and isolates the source zone section from the drift zone section;

a control section with at least one control electrode section in the control trench structure; and

a columnar field plate trench extending into the semiconductor body along the vertical direction and including a field plate electrode electrically coupled to the first load terminal;

wherein a horizontal distance between two columnar field plate trenches of two adjacent ones of the plurality of power cells decreases by at least 10% along the vertical direction.

19. A method of processing a power semiconductor die, the power semiconductor die having a semiconductor body coupled to a first load terminal and a second load terminal of the power semiconductor die and configured to conduct a load current between the load terminals, wherein the method comprises:

forming a control trench structure for controlling the load current, the control trench structure extending into the semiconductor body along a vertical direction and arranged in accordance with a horizontal grid pattern having a plurality of grid openings; and

forming a plurality of power cells, each power cell being, in a horizontal cross-section, at least partially arranged in a respective one of the plurality of grid openings, and comprising:

a section of a drift zone of a first conductivity type, a section of a channel zone of a second conductivity type and a section of a source zone of the first conductivity type, wherein the channel zone section is electrically connected to the first load terminal and isolates the source zone section from the drift zone section; and

a control section with at least one control electrode section in the control trench structure;

wherein the method comprises forming, in at least one of the power cells, a columnar field plate trench extending into the semiconductor body along the vertical direction and including a field plate electrode electrically coupled to the first load terminal, the columnar field plate trench having a deep portion below the channel zone section and a proximal portion above the deep portion, the proximal portion vertically overlapping with the channel zone section, wherein a deep horizontal width of the deep portion amounts to at least 110% of a proximal horizontal width of the proximal portion.

20. A method of processing a power semiconductor die, the power semiconductor die having a semiconductor body coupled to a first load terminal and a second load terminal of the power semiconductor die and configured to conduct a load current between the load terminals, wherein the method comprises:

forming a control trench structure for controlling the load current, the control trench structure extending into the semiconductor body along a vertical direction and arranged in accordance with a horizontal grid pattern having a plurality of grid openings; and

forming a plurality of power cells, each power cell being, in a horizontal cross-section, at least partially arranged in a respective one of the plurality of grid openings, and comprising:

a section of a drift zone of a first conductivity type, a section of a channel zone of a second conductivity type and a section of a source zone of the first conductivity type, wherein the channel zone section is electrically connected to the first load terminal and isolates the source zone section from the drift zone section; and

a control section with at least one control electrode section in the control trench structure;

wherein the method comprises forming, in each power cell, a columnar field plate trench extending into the semiconductor body along the vertical direction and including a field plate electrode electrically coupled to the first load terminal, wherein a horizontal distance between two columnar field plate trenches of two adjacent ones of the plurality of power cells decreases by at least 10% along the vertical direction.