IP Library Granted Patent US 10,879,485
Granted Patent B2
US 10,879,485 · App. 16/576,381 · Granted Dec 29, 2020

Organic light emitting diode display device and manufacturing method thereof

Inventor: Moojong Kim (Suwon-si, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H01L51/5203H01L27/326H01L27/3206H01L27/3248H01L27/3258H01L27/3276H01L51/5253H01L2227/323
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Quick Facts
Patent No.
US 10,879,485
App. No.
16/576,381
Granted
Dec 29, 2020
Kind
B2
Abstract

An organic light emitting diode display device includes a substrate. A first protective layer is disposed on the substrate. A conductive line is disposed on the first protective layer. A second protective layer is disposed on the conductive line. A first electrode is disposed on the second protective layer. An organic light emitting layer is disposed on the first electrode. A second electrode is disposed on the light emitting layer. The first electrode is symmetric with respect to a center of the conductive line.

Claims (29)

1. An organic light emitting diode display device comprising:

a substrate;

a first protective layer disposed on the substrate, the first protective layer having a recess disposed therein;

a conductive line disposed within the recess of the first protective layer;

a second protective layer disposed on the conductive line;

a first electrode disposed on the second protective layer, an organic light emitting layer disposed on the first electrode; and

a second electrode disposed on the light emitting layer, wherein the first electrode overlaps the recess of the first protective layer,

wherein a lower surface of the second protective layer is planar above an entirety of a portion of the conductive line, the portion of the conductive line overlapping the first electrode.

2. The organic light emitting diode display device as claimed in claim 1 , wherein the conductive line is a driving voltage line.

3. The organic light emitting diode display device as claimed in claim 1 , wherein a depth of the recess of the first protective layer is substantially equal to a thickness of the conductive line.

4. The organic light emitting diode display device as claimed in claim 1 , wherein a depth of the recess of the first protective layer is different from a thickness of the conductive line.

5. The organic light emitting diode display device as claimed in claim 1 , wherein the conductive line is planar across an entirety thereof.

6. The organic light emitting diode display device as claimed in claim 1 , wherein the conductive line extends in a radial direction, on a plane, with respect to a center of the first electrode.

7. The organic light emitting diode display device as claimed in claim 6 , wherein the conductive line has a crossed lattice shape.

8. The organic light emitting diode display device as claimed in claim 1 , further comprising a thin film transistor disposed between the substrate and the first protective layer.

9. The organic light emitting diode display device as claimed in claim 8 , wherein the thin film transistor is connected to the first electrode.

10. The organic light emitting diode display device as claimed in claim 8 , wherein the thin film transistor is connected to the conductive line.

11. A method of manufacturing an organic light emitting diode display device, the method comprising:

forming a photosensitive material layer on a substrate by applying a photosensitive material onto the substrate;

forming a first protective layer on the substrate by patterning the photosensitive material layer, the first protective layer having a recess and a contact hole therein;

forming a conductive line within the recess of the first protective layer;

forming a second protective layer on the conductive line;

forming a first electrode on the second protective layer, forming a light emitting layer on the first electrode; and

forming a second electrode on the light emitting layer,

wherein the first electrode overlaps the recess of the first protective layer, and

wherein a lower surface of the second protective layer is formed planar above an entirety of a portion of the conductive line, the portion of the conductive line overlapping the first electrode.

12. The method as claimed in claim 11 , wherein forming of the first protective layer comprises exposing the photosensitive material layer with light through a pattern mask.

13. The method as claimed in claim 11 , wherein the conductive line is formed planar across an entirety thereof.

14. The method as claimed in claim 11 , wherein the conductive line is formed having a crossed lattice shape.

Priority Claims (1)
KR 10-2016-0162811 · Dec 1, 2016 · national
Continuity (2)
Division 15825359 · Nov 29, 2017
Related Publication 20200013984A1 · Jan 9, 2020
Cited By (2)
US 12,471,458 US 12,484,407