Vertical antenna patch in cavity region

1. A device, comprising:

a multi-layer circuit structure having multiple layers stacked along a vertical direction;

at least one cavity region formed at an edge of the multi-layer circuit structure,

the at least one cavity region being formed of multiple non-conductive vias from which a dielectric substrate material of the multi-layer circuit structure is removed; and

at least one vertical antenna patch arranged in the at least one cavity region.

2. The device according to claim 1 ,

wherein the cavity region comprises:

at least one first conductive strip formed in one or more of the multiple layers and defining a first horizontal edge of the cavity region;

at least one second conductive strip formed in one or more of the multiple layers and defining a second horizontal edge of the cavity region; and

conductive vias extending between the at least one first conductive strip and the at least one second conductive strip and defining vertical outer edges of the cavity region.

3. The device according to claim 1 ,

wherein the non-conductive vias of the cavity region are arranged to form a mesh grid of the substrate material in the cavity region.

4. The device according to claim 1 ,

wherein the vertical antenna patch is formed of multiple conductive strips formed in one or more of the multiple layers, the conductive strips of the vertical antenna patch being electrically connected to each other by conductive vias extending between two or more of the conductive strips which are arranged on different layers of the multi-layer circuit structure.

5. The device according to claim 4 ,

wherein the conductive strips and the conductive vias of the antenna patch are arranged to form a mesh pattern.

6. The device according to claim 1 ,

wherein the non-conductive vias forming the cavity region are filled with a dielectric material having a lower dielectric constant than the substrate material of the multi-layer circuit structure.

7. The device according to claim 1 ,

wherein the non-conductive vias forming the cavity region are filled with air.

8. The device according to claim 1 , comprising:

at least one electrically floating patch capacitively coupled to the at least one antenna patch and arranged in a plane offset from the at least one antenna patch in a direction towards a periphery of the multi-layer circuit structure.

9. The device according to claim 8 ,

wherein the electrically floating patch is formed of multiple conductive strips in one or more of the multiple layers, the conductive strips of the electrically floating patch being electrically connected to each other by conductive vias extending between two or more of the conductive strips of the electrically floating patch, which are arranged on different layers of the multi-layer circuit structure.

10. The device according to claim 8 ,

wherein the electrically floating patch is formed by a vertical conductive strip formed on a casing element in which the multi-layer circuit structure is arranged.

11. The device according to claim 1 , comprising:

a casing element in which the multi-layer circuit structure is arranged; and

at least one dielectric patch arranged on the casing element in a plane facing the at least one antenna patch,

the at least one dielectric patch being configured with a variation pattern of dielectric constant.

12. The device according to claim 11 ,

wherein the at least one dielectric patch comprises non-conductive vias from which a dielectric substrate material of the dielectric patch is removed.

13. The device according to claim 12 ,

wherein the variation pattern is configured by setting a density of non-conductive vias of the dielectric patch and/or by setting a size of the non-conductive vias of the dielectric patch.

14. The device according to claim 13 ,

wherein the variation pattern defines an increase of dielectric constant towards a center of the dielectric patch.

15. The device according to claim 1 , comprising:

at least one feeding patch arranged in the at least one cavity region and configured for capacitive feeding of the at least one antenna patch,

the feeding patch being formed of multiple conductive strips in one or more of the multiple layers, the conductive strips of the feeding patch being electrically connected to each other by conductive vias extending between two or more of the conductive strips of the feeding patch, which are arranged on different layers of the multi-layer circuit structure.

16. The device according to claim 1 ,

wherein the substrate material of the multi-layer circuit structure comprises a ceramic material.

17. The device according to claim 1 ,

wherein the layers of the multi-layer circuit structure are assembled by low temperature co-firing.

18. The device according to claim 1 , comprising:

radio front end circuitry arranged on the multi-layer circuit structure.

19. The device according to claim 18 ,

wherein the multi-layer circuit structure comprises a cavity in which the radio front end circuitry is received.

20. A communication device, comprising:

at least one device according to claim 1 ; and

at least one processor configured to process communication signals transmitted via the at least one antenna patch of the at least one device.