Capturing plate, on-orbit device and method for capturing
A capturing plate is attached to an on-orbit device, and the capturing plate is attached to a part of the on-orbit device where a capturing device bonds to the on-orbit device in space with a bonding component, including adhesive, of the capturing device. A method for capturing the on-orbit device includes moving the capturing device including the bonding component to the on-orbit device and letting the bonding component of the capturing device adhere to the on-orbit device.
1. A capturing plate, the capturing plate comprising:
a base;
a surface treated layer disposed on a front side of the base; and
a magnetic layer disposed on a back side of the base,
wherein the capturing plate is included on an on-orbit device, the on-orbit device being configured to be captured by a capturing device, and
wherein the magnetic layer is configured to serve as a guide structure that defines a bonding position of the on-orbit device with the capturing device by a magnetic force and the surface treated layer is configured to permanently bond the on-orbit device to a bonding component including adhesive in the capturing device by an adhesive force of the adhesive, and
wherein the surface treated layer is a metal-oxide coating layer formed by anodic oxidation of aluminum of the base and includes a plurality of holes each having a diameter in a range from 100 nm to 150 nm to facilitate permeation of the adhesive into the plurality of holes.
2. The capturing plate according to claim 1 , wherein the surface-treated layer includes a mark or a color.
3. The capturing plate according to claim 1 , wherein the surface-treated layer is configured to reflect light.
4. The capturing plate according to claim 1 , wherein the capturing plate includes a plurality of divided pieces.
5. The capturing plate according to claim 1 , wherein the capturing plate is attached on a maximum principal axis of inertia of the on-orbit device.
6. The capturing plate according to claim 1 , wherein the adhesive is silicon adhesive.
7. The capturing plate according to claim 1 , further comprising a protrusion that is disposed on a surface of the capturing plate and configured to guide the capturing device.
8. A capture system, the capture system comprising:
a capturing plate included on an on-orbit device; and
a capture device configured to capture the on-orbit device and including a bonding component, the bonding component including adhesive,
wherein the capturing plate includes:
a base;
a surface treated layer disposed on a front side of the base; and
a magnetic layer disposed on a back side of the base,
wherein the magnetic layer is configured to serve as a guide structure that defines a bonding position of the on-orbit device with the capturing device by a magnetic force and the surface treated layer is configured to permanently bond the on-orbit device to the bonding component of the capturing device by an adhesive force of the adhesive.
9. The capture system according to claim 8 , wherein the surface treated layer is a metal-oxide coating layer formed by anodic oxidation of a material of the base.