Manufacturing method of flexible display apparatus
A manufacturing method of a flexible display apparatus is provided. A flexible display panel is formed on the substrate. The flexible display panel has a display area and a bonding area located outside the display area. A driving chip is bonded on the bonding area of the flexible display panel via at least one flexible circuit board. A hot-melt protective layer is formed on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board. A heating step is performed to soften the hot-melt protective layer. The flexible display panel is separated from the substrate.
1. A manufacturing method of a flexible display apparatus, comprising:
providing a substrate;
forming a flexible display panel on the substrate, wherein the flexible display panel has a display area and a bonding area located outside the display area;
bonding a driving chip on the bonding area of the flexible display panel via at least one flexible circuit board;
forming a hot-melt protective layer on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board;
performing a heating step to soften the hot-melt protective layer; and
separating the flexible display panel from the substrate,
wherein the driving chip is disposed on the flexible circuit board, and a location of the driving chip does not overlap with a location of the flexible display panel,
wherein the hot-melt protective layer adheres to a top surface of the flexible display panel facing away from the substrate.
2. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein the step of forming the flexible display panel on the substrate comprises:
forming an adhesive layer on the substrate; and
forming the flexible display panel on the substrate, wherein the flexible display panel is adhered to the substrate via the adhesive layer.
3. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein the flexible circuit board is bonded to the bonding area of the flexible display panel via an anisotropic conductive film.
4. The manufacturing method of the flexible display apparatus as recited in claim 1 , further comprising:
after separating the flexible display panel from the substrate, bonding an external circuit to the flexible circuit board, wherein the flexible display panel is electrically connected to the external circuit via the flexible circuit board.
5. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein a temperature of the heating step is between 70° C. and 140° C.
6. The manufacturing method of the flexible display apparatus as recited in claim 1 , further comprising:
after separating the flexible display panel from the substrate, bonding a protective layer to a bottom surface of the flexible display panel.