IP Library Granted Patent US 10,886,601
Granted Patent B2
US 10,886,601 · App. 16/258,869 · Granted Jan 5, 2021

Electronic device

Inventors: Kenichi Ishizuka (Nagaokakyo, JP); Takeaki Tamayama (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q1/243H01Q1/48H01Q7/00H01Q13/10H01Q21/28H04M1/02H05K7/20509
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Quick Facts
Patent No.
US 10,886,601
App. No.
16/258,869
Granted
Jan 5, 2021
Kind
B2
Abstract

An electronic device includes an antenna, and a plate-shaped heat spreader including first and second metal layers that are stacked, a working fluid in an enclosed space interposed between the first and second metal layers, and a joint along which outer peripheral portions around the enclosed space are joined. The heat spreader includes an operational region in which the enclosed space is located and a quasi-operational region other than the enclosed space. The antenna is provided in the quasi-operational region in a plan view of the heat spreader.

Claims (43)

1. An electronic device comprising:

an antenna; and

a plate-shaped heat spreader including a first metal layer and a second metal layer that are stacked, a working fluid in an enclosed space interposed between the first metal layer and the second metal layer, and a joint along which outer peripheral portions around the enclosed space are joined, wherein

the heat spreader includes an operational region in which the enclosed space is located and a quasi-operational region other than the enclosed space,

the antenna is provided in the quasi-operational region in a plan view of the heat spreader,

at least a portion of the quasi-operational region is located in a nonconductive area in which a conductor density is lower than that of another area in a plan view of the heat spreader,

the antenna is provided in the portion of the quasi-operational region that is located in the nonconductive area,

the heat spreader includes a bent portion in the portion of the quasi-operational region that is located in the nonconductive area, and

the bent portion is a portion of the antenna.

2. The electronic device according to claim 1 , wherein the nonconductive area is a non-ground area in which no ground conductor is provided.

3. The electronic device according to claim 1 , wherein at least a portion of the operational region is located in the nonconductive area in a plan view of the heat spreader.

4. The electronic device according to claim 1 , wherein the antenna is a standing-wave antenna that is used in a UHF band.

5. An electronic device comprising:

an antenna; and

a plate-shaped heat spreader including a first metal layer and a second metal layer that are stacked, a working fluid in an enclosed space interposed between the first metal layer and the second metal layer, and a joint along which outer peripheral portions around the enclosed space are joined, wherein

the heat spreader includes an operational region in which the enclosed space is located and a quasi-operational region other than the enclosed space,

the antenna is provided in the quasi-operational region in a plan view of the heat spreader,

at least a portion of the quasi-operational region is located in a nonconductive area in which a conductor density is lower than that of another area in a plan view of the heat spreader,

the antenna is provided in the portion of the quasi-operational region that is located in the nonconductive area,

the heat spreader includes a notch in the portion of the quasi-operational region that is located in the nonconductive area, and

the notch is a portion of the antenna.

6. The electronic device according to claim 5 , wherein the notch is provided in a portion of the first metal layer that is not stacked with the second metal layer.

7. The electronic device according to claim 5 , further comprising:

a power supply coil that includes a coil opening; wherein

the antenna is a magnetic-field antenna that is used in a HF band and that includes the power supply coil and the notch that overlaps the coil opening.

8. The electronic device according to claim 5 , wherein the notch has an L shape.

9. The electronic device according to claim 5 , wherein the notch extends through the first metal layer and the second metal layer.

10. The electronic device according to claim 5 , wherein a power supply circuit is connected at a position of the notch.

11. The electronic device according to claim 5 , wherein the antenna is a slot antenna defined by the notch.

12. The electronic device according to claim 5 , wherein the notch extends inward from an outer edge of the heat spreader.

13. The electronic device according to claim 5 , wherein a size of the first metal layer is different from a size of the second metal layer.

14. The electronic device according to claim 5 , wherein the nonconductive area is a non-ground area in which no ground conductor is provided.

15. The electronic device according to claim 5 , wherein at least a portion of the operational region is located in the nonconductive area in a plan view of the heat spreader.

16. An electronic device comprising:

an antenna; and

a plate-shaped heat spreader including a first metal layer and a second metal layer that are stacked, a working fluid in an enclosed space interposed between the first metal layer and the second metal layer, and a joint along which outer peripheral portions around the enclosed space are joined, wherein

the heat spreader includes an operational region in which the enclosed space is located and a quasi-operational region other than the enclosed space,

the antenna is provided in the quasi-operational region in a plan view of the heat spreader,

the heat spreader includes pillars in the enclosed space between the first metal layer and the second metal layer, and

the heat spreader includes projections provided on a surface of the second metal layer in the enclosed space and extending toward the first metal layer.

17. The electronic device according to claim 16 , wherein the pillars are made of a same material as the first metal layer and the second metal layer.

18. The electronic device according to claim 16 , wherein the heat spreader includes a wick disposed between the pillars and the projections.

19. The electronic device according to claim 18 , wherein the wick has a plate shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2019
From: ISHIZUKA, KENICHI; TAMAYAMA, TAKEAKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 048152/0871 →
Priority Claims (1)
JP 2017-132442 · Jul 6, 2017 · national
Continuity (2)
Continuation PCTJP2018020746 · May 30, 2018
Related Publication 20190157746A1 · May 23, 2019
Cited By (1)
US 12,449,866