IP Library › Granted Patent US 10,886,618
Granted Patent B2
US 10,886,618 · App. 16/260,505 · Granted Jan 5, 2021

Antenna apparatus and antenna module

Inventors: Nam Ki Kim (Suwon-si, KR); Ju Hyoung Park (Suwon-si, KR); Jeong Ki Ryoo (Suwon-si, KR); Myeong Woo Han (Suwon-si, KR); Dae Ki Lim (Suwon-si, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H01Q9/0457H01Q1/38H01Q9/0464H01Q21/0025H01Q21/065H01Q1/243
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,886,618
App. No.
16/260,505
Granted
Jan 5, 2021
Kind
B2
Abstract

An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.

Claims (50)

1. An antenna apparatus comprising:

a feed via;

a patch antenna pattern capable of being electrically connected to a first end of the feed via;

a plurality of first conductive array patterns, respectively spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern;

a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns, and surrounding the patch antenna pattern and the plurality of conductive array patterns;

a plurality of second conductive array patterns disposed above or below the plurality of first conductive array patterns, and arranged to correspond to at least the portion of the side boundary of the patch antenna pattern; and

a second conductive ring pattern disposed above or below the first conductive ring pattern and surrounding the plurality of second conductive array patterns.

2. The antenna apparatus of claim 1 , further comprising:

a ground layer comprising a through-hole configured to allow the feed via to pass therethrough; and

one or more grounding vias disposed to electrically connect the conductive ring pattern and the ground layer.

3. The antenna apparatus of claim 2 , wherein

the plurality of conductive array patterns are electrically separated from the ground layer.

4. The antenna apparatus of claim 2 , wherein

the at least one grounding via comprises a plurality of vias, and are arranged to surround the feed via.

5. The antenna apparatus of claim 2 , further comprising:

a feed line; and

an end-fire antenna pattern electrically connected to one end of the feed line,

wherein the at least one grounding via is disposed between the patch antenna pattern and the end-fire antenna pattern.

6. The antenna apparatus of claim 1 , further comprising:

a plurality of array vias disposed to electrically connect the plurality of first conductive array patterns and the plurality of second conductive array patterns, respectively; and

at least one connection via disposed to electrically connect the first conductive ring pattern and the second conductive ring pattern.

7. The antenna apparatus of claim 1 , further comprising:

a coupling patch pattern disposed above the patch antenna pattern,

wherein at least a portion of the coupling patch pattern is surrounded by the plurality of second conductive array patterns.

8. The antenna apparatus of claim 7 , wherein

the first conductive ring pattern, the plurality of first conductive array patterns, and the patch antenna pattern are disposed on a same first level, and

the second conductive ring pattern, the plurality of second conductive array patterns, and the coupling patch pattern are disposed on a same second level.

9. The antenna apparatus of claim 8 , further comprising:

a plurality of third conductive array patterns disposed between the plurality of first conductive array patterns and the plurality of second conductive array patterns and arranged to correspond to at least the portion of the side boundary of the patch antenna pattern; and

a third conductive ring pattern disposed between the first conductive ring pattern and the second conductive ring pattern and configured to surround the plurality of third conductive array patterns.

10. The antenna apparatus of claim 1 , wherein

the plurality of first conductive array patterns has a same shape, and are spaced apart from each other, and

an interval between each of the plurality of first conductive array patterns is shorter than an interval between the plurality of first conductive array patterns and the first conductive ring pattern.

11. An antenna module comprising:

a plurality of patch antennas;

a first conductive perforated plate pattern comprising a plurality of arrangement spaces in which the respective ones of the plurality of patch antennas are disposed;

a second conductive perforated plate pattern disposed above or below the conductive perforated plate pattern and comprising a same shape as a shape of the conductive perforated plate pattern; and

at least one connection via disposed to electrically connect the first conductive perforated plate pattern and the second conductive perforated plate pattern,

wherein at least one of the plurality of patch antennas comprises:

a feed via;

a patch antenna pattern capable of being electrically connected to a first end of the feed via; and

a plurality of conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern.

12. The antenna module of claim 11 , further comprising:

a ground layer disposed below the plurality of patch antennas and comprising a through-hole which allows the feed via to pass therethrough; and

at least one grounding via electrically connected to the conductive perforated plate pattern and the ground layer.

13. The antenna module of claim 12 , further comprising:

a plurality of end-fire antennas,

wherein the at least one grounding via comprises a plurality of vias and are respectively disposed between the plurality of patch antennas and the plurality of end-fire antennas.

14. The antenna module of claim 13 , further comprising:

an integrated circuit (IC) disposed below the ground layer, and electrically connected to each of the plurality of patch antennas and the plurality of end-fire antennas.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2019
From: KIM, NAM KI; PARK, JU HYOUNG; RYOO, JEONG KI; HAN, MYEONG WOO; LIM, DAE KI
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 048165/0939 →
Priority Claims (2)
KR 10-2018-0037621 · Mar 30, 2018 · national
KR 10-2018-0079286 · Jul 9, 2018 · national
Continuity (1)
Related Publication 20190305432A1 · Oct 3, 2019