Apparatus for gaseous byproduct abatement and foreline cleaning
Embodiments disclosed herein include an abatement system and method for abating compounds produced in semiconductor processes. The abatement system includes a remote plasma source for generating an oxidizing plasma for treating exhaust gases from a deposition process performed in the processing chamber, the treatment assisting with the trapping particles in an exhaust cooling apparatus. The remote plasma source then generates a cleaning plasma for treating exhaust gases from a cleaning process performed in the processing chamber, the cleaning plasma reacting with the trapped particles in the exhaust cooling apparatus and cleaning the exhaust cooling apparatus.
1. An abatement system for a processing chamber, comprising:
an exhaust system comprising a vacuum pump coupled to the processing chamber;
an exhaust cooling apparatus coupled to an exhaust foreline of the exhaust system between the processing chamber and the vacuum pump; and
a remote plasma source positioned remote from the exhaust foreline and having a conduit that has an outlet for supplying a remote generated plasma directly to the exhaust foreline downstream of the processing chamber and before the exhaust cooling apparatus, and the remote plasma source connected to an oxygen gas source, a cleaning gas source and an inert gas source,
wherein the outlet of the conduit of the remote plasma source is positioned to cause the remote generated plasma to enter the exhaust foreline at a position that is adjacent to an entrance to an exhaust cooling apparatus connection to the foreline.
2. The abatement system of claim 1 , further comprising a controller, wherein the controller causes the remote plasma source to further supply a gas to the exhaust system.
3. The abatement system of claim 1 , wherein the cleaning gas source supplies NF 3 , NF 2 H, CHF 3 or CF 4 to the remote plasma source.
4. The abatement system of claim 1 , wherein the inert gas source supplies argon to the remote plasma source.
5. The abatement system of claim 1 , wherein the outlet of the remote plasma source is fluidly connected to enter the exhaust foreline at a position within between 6 and 18 inches upstream from the entrance to the exhaust cooling apparatus.
6. The abatement system of claim 1 , wherein the remote plasma source is one of an inductively coupled plasma source, a capacitively coupled plasma source, a direct current plasma source or a microwave plasma source.
7. The abatement system of claim 1 , wherein the outlet of the remote plasma source is positioned in the exhaust foreline and at least 10 feet from a location where the exhaust foreline couples to a chamber exhaust port.
8. A processing system, comprising:
a processing chamber;
an exhaust system comprising a vacuum pump coupled to the processing chamber;
an exhaust cooling apparatus coupled to an exhaust foreline of the exhaust system between the processing chamber and the vacuum pump; and
a remote plasma source positioned remote from the exhaust foreline and having a conduit that connects the remote plasma source to the exhaust foreline for supplying a remote generated plasma directly to the exhaust foreline downstream of the processing chamber and before the exhaust cooling apparatus, the remote plasma source connected to an oxygen gas source, a cleaning gas source and an inert gas source,
wherein an outlet of the conduit of the remote plasma source is positioned to cause the remote generated plasma to enter the exhaust foreline at a position that is adjacent to an entrance to an exhaust cooling apparatus connection to the foreline.
9. The processing system of claim 8 , further comprising a controller, wherein the controller causes the remote plasma source to further supply a gas to the exhaust system.
10. The processing system of claim 8 , wherein the cleaning gas source supplies NF 3 , NF 2 H, CHF 3 or CF 4 to the remote plasma source.
11. The processing system of claim 8 , wherein the inert gas source supplies argon to the remote plasma source.
12. The processing system of claim 8 , wherein the outlet of the remote plasma source is fluidly connected to enter the exhaust foreline at a position within between 6 and 18 inches upstream from the entrance to the exhaust cooling apparatus.
13. The processing system of claim 8 , wherein the remote plasma source is one of an inductively coupled plasma source, a capacitively coupled plasma source, a direct current plasma source or a microwave plasma source.
14. The processing system of claim 8 , wherein the outlet of the remote plasma source is positioned in the exhaust foreline and at least 10 feet from where the exhaust foreline couples to a chamber exhaust port.
15. A system comprising a controller, wherein the controller comprises a central processing unit and a memory, and the memory further includes software that when executed by the central processing unit causes the following operations to be performed:
treating of exhaust gases from a deposition process performed in a processing chamber of the system using an oxidizing plasma generated from a remote plasma source that has an outlet that is coupled to an exhaust foreline that fluidly connects the processing chamber and an exhaust cooling apparatus, which is fluidly connected to a vacuum pump, wherein the oxidizing plasma comprises an oxidizing gas; and
treating of exhaust gases from a cleaning process performed in the processing chamber of the processing system using a cleaning plasma generated from the remote plasma source, wherein
the cleaning plasma comprises a cleaning gas provided from a cleaning gas source, and
the outlet of the remote plasma source is positioned to cause the generated oxidizing plasma and the generated cleaning plasma to enter the exhaust foreline at a position that is adjacent to an entrance of the exhaust cooling apparatus.