Method for manufacturing multilayer substrate
A multilayer substrate includes a lamination body including a first resin substrate, a second resin substrate, and a bonding layer that are hot-pressed. A first conductor pattern including a surface defined by a plated film is disposed on a first surface of the first resin substrate. A second conductor pattern including a surface defined by a plated film is disposed on a second surface of the first resin substrate. A third conductor pattern including a surface defined by a plated film is disposed on a third surface of the second resin substrate. A fourth conductor pattern including a surface defined by a plated film is disposed on a fourth surface of the second resin substrate. The first conductor pattern is located closer to one outermost layer than the second conductor pattern is. The second conductor pattern is thinner than the first conductor pattern.
1. A method for manufacturing a multilayer substrate, comprising:
forming a first conductor pattern by plating on a first surface of a first resin substrate more thickly than a second conductor pattern formed by plating on a second surface, opposite to the first surface, of the first resin substrate, forming a third conductor pattern by plating on a third surface, facing the second surface, of a second resin substrate, and forming a fourth conductor pattern by plating on a fourth surface, opposite to the third surface, of the second resin substrate; and
after forming the first to fourth conductor patterns by plating, laminating and thermocompression-bonding together a plurality of layers including the first resin substrate, the second resin substrate, and a bonding layer including no conductor pattern while holding the bonding layer between the second surface of the first resin substrate and the third surface of the second resin substrate, and locating the first conductor pattern on the first surface closer to one outermost layer.
2. The method according to claim 1 , wherein a thickness of the third conductor pattern is formed to be larger than a thickness of the fourth conductor pattern.
3. The method according to claim 1 , wherein the bonding layer has higher fluidity at a predetermined pressing temperature than the first and second resin substrates.
4. The method according to claim 1 , wherein the first conductor pattern, the second conductor pattern, the third conductor pattern, and the fourth conductor pattern each include a base made of metal foil and a plated film that is thicker than the base.
5. The method according to claim 4 , wherein the metal foil is copper foil and the plated film is a copper-plated film.
6. The method according to claim 1 , wherein the second and third conductor patterns include portions overlapping in a plan view.
7. The method according to claim 1 , wherein the second resin substrate is located closer to a mount surface than the first resin substrate is.
8. The method according to claim 1 , wherein the second conductor pattern is arranged at a uniform pitch in a cross section taken in a lamination direction in which the first resin substrate and the second resin substrate are laminated, and the third conductor pattern is arranged at a uniform pitch in the cross section and displaced from the second conductor pattern in a direction of the pitch.
9. The method according to claim 1 , wherein each of the first to fourth conductor patterns is a coil conductor pattern.
10. The method according to claim 1 , wherein
a terminal electrode is disposed on a mount surface of a lamination body including the first and second resin substrates and the bonding layer laminated together; and
the mount surface is located closer to the second resin substrate than to the first resin substrate.
11. The method according to claim 10 , wherein the terminal electrode is disposed at a position at which the terminal electrode does not overlap the first to fourth conductor patterns in a plan view.