IP Library › Granted Patent US 10,894,935
Granted Patent B2
US 10,894,935 · App. 15/984,050 · Granted Jan 19, 2021

Composition for removing silicone resins and method of thinning substrate by using the same

Inventors: In-goo Kang (Hwaseong-si, KR); Sung-bae Kim (Seongnam-si, KR); Baik-soon Choi (Anyang-si, KR); Sue-ryeon Kim (Hwaseong-si, KR); Young-taek Hong (Hwaseong-si, KR); Sang-tae Kim (Iksan-si, KR); Kyong-ho Lee (Osan-si, KR); Hyung-pyo Hong (Seongnam-si, KR); Seong-min Kim (Iksan-si, KR)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; DONGWOO FINE-CHEM CO., LTD.
C11D7/5013C11D1/00C11D3/0073C11D3/2096C11D3/245C11D3/28C11D3/30C11D3/43C11D7/3209C11D11/0047H01L21/02057H01L21/304H01L21/31133H01L21/6835H01L21/76898B32B38/10B32B43/006B32B2457/14C09J183/04C11D7/267C11D7/3281H01L21/67051H01L24/05H01L24/13H01L24/16H01L25/0657H01L2221/6834H01L2221/68318H01L2221/68327H01L2221/68381H01L2224/0401H01L2224/0557H01L2224/13023H01L2224/13025H01L2224/13111H01L2224/16145H01L2224/16225H01L2225/06541H01L2225/06586H01L2924/15311H01L2924/181
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Quick Facts
Patent No.
US 10,894,935
App. No.
15/984,050
Granted
Jan 19, 2021
Kind
B2
Abstract

Compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins are provided. The compositions for removing silicone resins, may include a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R) 4 N + F − , wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.

Claims (52)

1. A composition for removing silicone resins, the composition comprising:

a heterocyclic solvent; and

an alkyl ammonium fluoride salt represented by Formula (1):

(R) 4 N + F −   Formula (1)

wherein R is a C3 or C4 linear alkyl group,

wherein the heterocyclic solvent comprises at least one selected from the group consisting of a pyridine solvent, a morpholine solvent, a piperazine solvent, a urea solvent, and an oxazolidinone solvent, and

wherein the composition comprises a protic solvent in an amount less than 10% based on a total weight of the compositions, wherein the heterocyclic solvent is present in an amount of about 90 wt % to about 99 wt % based on a total weight of the composition, and wherein the alkyl ammonium fluoride salt represented by Formula (1) is present in an amount of about 0.1 wt % to about 10 wt % based on a total weight of the composition.

2. The composition according to claim 1 , wherein the amount of the protic solvent is 3 wt % or less of the composition.

3. The composition according to claim 2 , wherein the protic solvent comprises at least one of water and an alcohol.

4. The composition according to claim 1 , further comprising:

a surfactant; and

a corrosion inhibitor.

5. A composition for removing silicone resins, the composition comprising:

a heterocyclic solvent; and

an alkyl ammonium fluoride salt represented by Formula (1):

(R) 4 N + F −   Formula (1)

wherein R is a C3 or C4 linear alkyl group;

wherein the alkyl ammonium fluoride salt is present in an amount of about 0.1 wt % to about 10 wt % based on a total weight of the composition,

wherein the heterocyclic solvent has a 4- to 8-membered ring;

wherein the heterocyclic solvent is at least one selected from the group consisting of a nitrogen-containing and oxygen-containing heterocyclic solvent; and

wherein the heterocyclic solvent is present in an amount of about 70 wt % to about 99.9 wt % based on a total weight of the composition.

6. The composition according to claim 5 , wherein the heterocyclic solvent comprises at least one selected from the group consisting of a pyridine solvent, a morpholine solvent, a piperazine solvent, a urea solvent, and an oxazolidinone solvent.

7. The composition according to claim 5 , wherein the composition comprises a protic solvent in an amount of 3 wt % or less of the composition.

8. The composition according to claim 5 , wherein the composition comprises any one of water and alcohol in an amount of 3 wt % or less of the composition.

9. A system for temporarily bonding a target substrate to a carrier substrate to facilitate processing of the target substrate, the system comprising:

a carrier substrate;

a silicone binder configured to bond the carrier substrate to the target substrate;

a separation apparatus configured to separate the carrier substrate and the target substrate from one another such that a residue of the silicone binder remains on the target substrate; and

a composition configured to remove the residue, wherein the composition comprises a heterocyclic solvent and an alkyl ammonium fluoride salt represented by Formula (1):

(R) 4 N + F −   Formula (1)

wherein R is a C3 or C4 linear alkyl group,

wherein the heterocyclic solvent comprises at least one selected from the group consisting of a pyridine solvent, a morpholine solvent, a piperazine solvent, a urea solvent, and an oxazolidinone solvent, and

wherein the composition comprises a protic solvent in an amount of 3 wt % of less based on a total weight of the composition, wherein the heterocyclic solvent is present in an amount of about 90 wt % to about 99 wt % based on a total weight of the composition, and wherein the alkyl ammonium fluoride salt represented by Formula (1) is present in an amount of about 0.1 wt % to about 10 wt % based on a total weight of the composition.

10. The system of claim 9 , wherein the silicone binder comprises:

a silicone release layer configured to contact the target substrate; and

a silicone adhesive layer disposed on the silicone release layer and contacting the carrier substrate.

11. The composition according to claim 1 , wherein the heterocyclic solvent comprises a pyridine solvent represented by Formula (2):

wherein each of R 1 , R 2 , and R 3 are independently a hydrogen, a halogen element, a C1 to C22 branched or non-branched alkyl group, a C1 to C10 alkoxy group, a C2 to C22 branched or non-branched alkenyl group, a C1 to C20 alkylamino group, a C6 to C20 aryl or alkylaryl group, a C7 to C20 arylalkyl group, a C5 to C12 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

12. The composition according to claim 1 , wherein the heterocyclic solvent comprises at least one selected from the group consisting of 2-methylpyridine, 3-methylpyridine, 4-methylpyridine, 4-ethylpyridine, 4-propylpyridine, 4-isopropylpyridine, 4-amylpyridine, 2,3-lutidine, 2,4-lutidine, 2,5-lutidine, 3,4-lutidine, 3,5-lutidine, and 2,4,6-trimethylpyridine.

13. The composition according to claim 1 , wherein the heterocyclic solvent comprises a morpholine solvent represented by Formula (3):

wherein R 4 is a hydrogen, a halogen element, a C1 to C6 branched or non-branched alkyl group, a C1 to C6 alkoxy group, a C2 to C6 branched or non-branched alkenyl group, a C1 to C6 alkylamino group, a C6 to C15 aryl or alkylaryl group, a C7 to C15 arylalkyl group, a C5 to C10 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

14. The composition according to claim 13 , wherein R 4 is a phenyl group substituted with a C1 to C4 aliphatic hydrocarbon, a halogen element, a cyanide group, or an aldehyde group; or R 4 is a pyridine group substituted with a C1 to C4 aliphatic hydrocarbon, a halogen element, a cyanide group, or an aldehyde group.

15. The composition according to claim 1 , wherein the heterocyclic solvent comprises a piperazine solvent represented by Formula (4):

wherein each of R 5 and R 6 is a hydrogen, a halogen element, a C1 to C6 branched or non-branched alkyl group, a C1 to C6 alkoxy group, a C2 to C6 branched or non-branched alkenyl group, a C1 to C6 alkylamino group, a C6 to C15 aryl or alkylaryl group, a C7 to C15 arylalkyl group, a C5 to C10 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

16. The composition according to claim 15 , wherein R 5 or R 6 is a phenyl group substituted with a C1 to C4 aliphatic hydrocarbon, a halogen element, a cyanide group, or an aldehyde group; or R 5 or R 6 is a pyridine group substituted with a C1 to C4 aliphatic hydrocarbon, a halogen element, a cyanide group, or an aldehyde group.

17. The composition according to claim 1 , wherein the heterocyclic solvent comprises a pyrrolidone solvent represented by Formula (5):

wherein R 7 is a hydrogen, a halogen element, a C1 to C6 branched or non-branched alkyl group, a C1 to C6 alkoxy group, a C2 to C6 branched or non-branched alkenyl group, a C1 to C6 alkylamino group, a C6 to C15 aryl or alkylaryl group, a C7 to C15 arylalkyl group, a C5 to C10 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

18. The composition according to claim 1 , wherein the heterocyclic solvent comprises a urea solvent represented by Formula (6):

wherein each of R 8 and R 9 is a hydrogen, a halogen element, a C1 to C6 branched or non-branched alkyl group, a C1 to C6 alkoxy group, a C2 to C6 branched or non-branched alkenyl group, a C1 to C6 alkylamino group, a C6 to C15 aryl or alkylaryl group, a C7 to C15 arylalkyl group, a C5 to C10 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

19. The composition according to claim 1 , wherein the heterocyclic solvent comprises a oxazolidinone solvent represented by Formula (7):

wherein R 10 is a hydrogen, a halogen element, a C1 to C6 branched or non-branched alkyl group, a C1 to C6 alkoxy group, a C2 to C6 branched or non-branched alkenyl group, a C1 to C6 alkylamino group, a C6 to C15 aryl or alkylaryl group, a C7 to C15 arylalkyl group, a C5 to C10 cycloalkyl group, an aldehyde group, an acetaldehyde group, a cyanide group, or a methyl sulfide group.

20. The composition according to claim 5 , wherein the composition comprises alcohol in an amount of 3 wt% or less of the composition.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2018
From: KANG, IN-GOO; KIM, SUNG-BAE; KIM, SUE-RYEON; CHOI, BAIK-SOON; HONG, YOUNG-TAEK; KIM, SANG-TAE; KIM, SUNG-MIN; LEE, KYONG-HO; HONG, HYUNG-PYO
To: SAMSUNG ELECTRONICS CO., LTD.; DONGWOO FINE-CHEM CO., LTD.
Reel/Frame 046665/0496 →
Priority Claims (1)
KR 10-2015-0172656 · Dec 4, 2015 · national
Continuity (2)
Continuation In Part 15369859 · Dec 5, 2016
Related Publication 20180265819A1 · Sep 20, 2018
Cited By (1)
US 12,463,043