IP Library › Granted Patent US 10,899,603
Granted Patent B2
US 10,899,603 · App. 16/178,716 · Granted Jan 26, 2021

Micromechanical z-inertial sensor

Inventors: Ralf Boessendoerfer (Dinkelsbuehl, DE); Jan Waldmann (Reutlingen, DE); Jochen Reinmuth (Reutlingen, DE)
Assignee: Robert Bosch GmbH
B81B3/0043B81B7/02B81C1/00198G01P15/125B81B2201/0235G01P2015/0831
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Quick Facts
Patent No.
US 10,899,603
App. No.
16/178,716
Granted
Jan 26, 2021
Kind
B2
Abstract

A micromechanical z-inertial sensor, having a movable MEMS structure developed in a micromechanical function layer; a torsion spring connected to the movable MEMS structure; and a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the MEMS structure in a defined manner.

Claims (16)

1. A z-inertial sensor, comprising:

a movable structure developed in a function layer;

a torsion spring connected to the movable structure; and

a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the structure in a defined manner.

2. The z-inertial sensor as recited in claim 1 , wherein a height of the spring device amounts to approximately one-third to approximately one-tenth of a height of the torsion spring.

3. The z-inertial sensor as recited in claim 1 , wherein the spring device is attached to a substrate.

4. The z-inertial sensor as recited in claim 3 , wherein the spring device is developed in a layer that is developed between the substrate and the function layer.

5. The z-inertial sensor as recited in claim 1 , wherein the spring device is at least partly situated below the movable structure.

6. The z-inertial sensor as recited in claim 1 , wherein the spring device is at least partly developed above the function layer.

7. The z-inertial sensor as recited claim 1 , wherein one end of the torsion spring is connected to a part of the spring device that is developed above the function layer, and another part of the torsion spring is connected to a part of the spring device that is developed below the function layer.

8. The z-inertial sensor as recited in claim 1 , wherein the spring device has sections that have an orthogonal alignment with respect to one another.

9. The z-inertial sensor as recited in claim 8 , wherein at least one element of the spring device has a reinforcement structure.

10. A method for producing a z-inertial sensor, comprising:

providing a movable structure developed in a function layer;

providing a torsion spring connected to the movable structure; and

providing a spring device connected to the torsion spring in such a way that a deflection of the torsion spring orthogonal to a sensing direction of the structure is able to be hampered in a defined manner.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2019
From: BOESSENDOERFER, RALF; WALDMANN, JAN; REINMUTH, JOCHEN
To: ROBERT BOSCH GMBH
Reel/Frame 048274/0682 →
Priority Claims (1)
DE 10 2017 219 929 · Nov 9, 2017 · national
Continuity (1)
Related Publication 20190135612A1 · May 9, 2019