Microscale metallic CNT templated devices and related methods

1. A method, comprising:

growing, by a chemical vapor deposition, a patterned forest of vertically aligned carbon nanotubes, wherein the patterned forest defines a component of a microscale device;

applying a conformal non-metal coating to the vertically aligned carbon nanotubes throughout the patterned forest, wherein the conformal non-metal coating comprises a substantially uniform thickness along a length of the vertically aligned carbon nanotubes;

connecting adjacent vertically aligned carbon nanotubes together with the conformal non-metal coating without filling interstices between the adjacent vertically aligned carbon nanotubes, wherein the connecting of the vertically aligned carbon nanotubes is configured to increase a strength of the vertically aligned carbon nanotubes of the patterned forest above a threshold level to withstand forces applied during a wet etching process; and

infiltrating the interstices between the adjacent vertically aligned carbon nanotubes with a metallic material.

2. The method of claim 1 , wherein the conformal non-metal coating is a silicon or silicon nitride.

3. The method of claim 1 , wherein the conformal non-metal coating is a ceramic material.

4. The method of claim 1 , wherein the metallic material is nickel.

5. The method of claim 1 , wherein a height of the vertically aligned carbon nanotubes are between 3 microns and 9 microns.

6. A method, comprising:

growing a patterned forest of intertwined carbon nanotubes, wherein the patterned forest comprises:

a first portion defining a first component of a microscale device; and

a second portion defining a second component of the microscale device;

applying a conformal non-metal coating to the intertwined carbon nanotubes throughout the patterned forest, wherein the conformal non-metal coating comprises a substantially uniform thickness;

infiltrating the patterned forest with a first interstitial material that is different than the non-metal coating, wherein the first interstitial material at least partially fills interstices between the intertwined carbon nanotubes;

applying a sacrificial layer over the first portion of the patterned forest; and

electrodepositing a second interstitial material on the second portion of the patterned forest.

7. The method of claim 6 , further comprising electrically isolating the first component of the microscale device and the second component of the microscale device, wherein:

the first component is a resonator of a microscale sensing device, wherein the resonator is configured to sense a change in resonant frequency; and

the second component is a sense electrode of the microscale sensing device.

8. The method of claim 7 , further comprising electropolishing the second component prior to applying the sacrificial layer to increase the sensing of the microscale sensing device.

9. The method of claim 6 , wherein the sacrificial layer is deposited between the first component and the second component.

10. The method of claim 6 , wherein the second interstitial material is electrodeposited between the first component and the second component.

11. The method of claim 6 , wherein the second interstitial material is electrodeposited over the first component.

12. The method of claim 6 , further comprising removing the sacrificial layer, wherein the removing of the sacrificial layer creates a sensing gap between the first component and the second component.

13. The method of claim 12 , wherein the sensing gap is a capacitive sensing gap between a resonator of a microscale sensing device and a sense electrode of the microscale sensing device, wherein the resonator is configured to sense a change in resonant frequency.

14. The method of claim 12 , wherein the sensing gap comprises a height-to-width ratio of at least 100:1.

15. A method for forming a device, comprising:

applying a catalyst to a substrate to create a pattern on a substrate;

initiating growth of carbon nanotubes from the catalyst;

at least partially coating to the carbon nanotubes with a ceramic material, wherein:

a thickness of the ceramic material is substantially uniform;

interstices between the carbon nanotubes remain;

the carbon nanotubes have a height-to-width ratio of 100:1; and

a strength of the carbon nanotubes is below a threshold level to withstand forces applied during a wet etching process; and

interlocking the carbon nanotubes together by infiltrating the carbon nanotubes with a metal material, wherein:

the metal material at least partially fills the interstices between the carbon nanotubes; and

the interlocking of the carbon nanotubes increases the strength of the carbon nanotubes above the threshold level to withstand the forces applied during the wet etching process.

16. The method of claim 15 , further comprising, infiltrating the interstices between the carbon nanotubes with a metallic material, wherein the infiltrating further increases the strength of the carbon nanotubes above the threshold level to withstand the forces applied during the wet etching process.

17. The method of claim 16 , wherein the infiltrating is performed by a nickel sulfamate bath or a nickel chloride bath.

18. The method of claim 15 , wherein the height-to-width ratio is 200:1.

19. The method claim 15 , wherein the ceramic material is silicon or silicon nitride.

20. The method of claim 15 , wherein the uniform coating is applied by a pulsed current.