Semiconductor apparatus and manufacturing method of semiconductor apparatus
A semiconductor apparatus 1 includes a circuit substrate 3 having a circuit pattern layer 3 c on an upper principal surface, semiconductor elements 4 a and 4 b mounted on the circuit pattern layer 3 c of the circuit substrate 3 , a printed substrate 6 arranged apart from the circuit substrate 3 on the upper principal surface side of the circuit substrate 3 , a housing 2 mold-sealing the upper principal surface side of the circuit substrate 3 , and a block 10 provided sandwiching at least part of the housing 2 and being opposite to the circuit substrate 3 , the block having a linear expansion coefficient smaller than that of the housing 2.
1. A semiconductor apparatus, comprising:
a first circuit substrate having a circuit pattern layer on a first surface;
a semiconductor element mounted on the circuit pattern layer of the first circuit substrate;
a sealing member to mold-seal the first-surface side of the first circuit substrate; and
a block provided sandwiching at least part of the sealing member and being opposite to the first circuit substrate, the block having a linear expansion coefficient smaller than that of the sealing member, the block being formed from an insulation material, wherein
at least part of the block is sandwiched by the sealing member in a longitudinal direction, and
the block extends across a midpoint of the sealing member in the longitudinal direction.
2. The semiconductor apparatus according to claim 1 , wherein
the block has the longitudinal direction in the same direction as a longitudinal direction of the sealing member.
3. The semiconductor apparatus according to claim 1 , wherein
the block is sandwiched by the sealing member in the longitudinal direction.
4. The semiconductor apparatus according to claim 2 , wherein
the sealing member has a recess in a surface on an opposite side to the first circuit substrate, and
the block is fitted into the recess.
5. The semiconductor apparatus according to claim 1 , wherein
the block is entirely sandwiched by the sealing member in the longitudinal direction.
6. The semiconductor apparatus according to claim 1 , wherein
the first circuit substrate is provided close to a lower surface side than an upper surface side of the sealing member, and
the block is provided close to the upper surface side than the lower surface side of the sealing member.
7. The semiconductor apparatus according to claim 1 , further comprising:
a second circuit substrate arranged apart from the first circuit substrate on the first-surface side of the first circuit substrate, and
the block is provided sandwiching at least part of the sealing member and being opposite to a surface on an opposite side to the first circuit substrate in the second circuit substrate.
8. The semiconductor apparatus according to claim 7 , further comprising:
a second conductive post having one end which is connected to the circuit pattern layer of the first circuit substrate, and the other end which is exposed as an external terminal from a surface on an opposite side to the first circuit substrate in the sealing member.
9. The semiconductor apparatus according to claim 7 , wherein
at least one of the circuit pattern layer of the first circuit substrate and an electrode of the semiconductor element is connected to a circuit pattern layer of the second circuit substrate through a first conductive post.
10. The semiconductor apparatus according to claim 1 , a length of the block in the longitudinal direction is more than a half of a length of the sealing member in the longitudinal direction.
11. The semiconductor apparatus according to claim 3 , wherein
the block has a nut hole for inserting a nut into the surface on the opposite side to the first circuit substrate.
12. The semiconductor apparatus according to claim 3 , wherein
the sealing member has a through hole to insert a bolt thereinto for fixing the first circuit substrate side of the semiconductor apparatus to a plate, and
the block has a barrier portion which is positioned between the through hole and an external terminal exposed from the surface on the opposite side to the first circuit substrate in the sealing member, and extends in a direction opposite to the first circuit substrate side.