IP Library Granted Patent US 10,903,206
Granted Patent B2
US 10,903,206 · App. 16/238,590 · Granted Jan 26, 2021

Semiconductor device and electronic device

Inventors: Junpei Momo (Kanagawa, JP); Kazutaka Kuriki (Kanagawa, JP); Hiromichi Godo (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/0629H01G11/14H01L27/1207H01L27/1211H01L27/1225H01L29/66742H01L29/786H01L29/7869H01L29/78696H01G11/08H01L21/8258H01L27/0688Y02E60/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,903,206
App. No.
16/238,590
Granted
Jan 26, 2021
Kind
B2
Abstract

A semiconductor device in which a circuit and a power storage element are efficiently placed is provided. The semiconductor device includes a first transistor, a second transistor, and an electric double-layer capacitor. The first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate. A band gap of a semiconductor constituting a channel region of the second transistor is wider than a band gap of a semiconductor constituting a channel region of the first transistor. The electric double-layer capacitor includes a solid electrolyte.

Claims (48)

1. A semiconductor device comprising:

a first transistor comprising a first gate electrode, a first source electrode, and a first drain electrode;

a first insulating film over each of the first gate electrode, the first source electrode, and the first drain electrode;

an electric double-layer capacitor over the first insulating film, and

a second insulating film over the electric double-layer capacitor; and

a second transistor over the second insulating film;

wherein the first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate,

wherein the first transistor includes a first semiconductor in a channel region,

wherein the second transistor includes a second semiconductor in a channel region,

wherein a band gap of the second semiconductor is wider than a band gap of the first semiconductor,

wherein the second transistor comprises a second gate electrode over the second semiconductor and a third gate electrode below the second semiconductor,

wherein one of a source and a drain of the second transistor is electrically connected to a current collector of the electric double-layer capacitor,

wherein the second insulating film covers the electric double-layer capacitor, and

wherein the electric double-layer capacitor includes an ionic liquid.

2. The semiconductor device according to claim 1 ,

wherein the first semiconductor includes silicon, and

wherein the second semiconductor includes an oxide semiconductor.

3. The semiconductor device according to claim 1 , wherein the electric double-layer capacitor is capable of being charged wirelessly.

4. The semiconductor device according to claim 1 , wherein the substrate is a semiconductor substrate.

5. The semiconductor device according to claim 1 , wherein the substrate is a flexible substrate.

6. An electronic device comprising:

the semiconductor device according to claim 1 ; and

at least one of a microphone, a speaker, a display portion, and an operation key.

7. The semiconductor device according to claim 1 , wherein the channel region of the first transistor and the channel region of the second transistor overlap with each other.

8. The semiconductor device according to claim 1 , wherein the one of the source and the drain of the second transistor is electrically connected to the current collector of the electric double-layer capacitor through an opening penetrating the second semiconductor.

9. A semiconductor device comprising:

a first transistor comprising a first gate electrode, a first source electrode, and a first drain electrode;

a first insulating film over each of the first gate electrode, the first source electrode, and the first drain electrode;

an electric double-layer capacitor over the first insulating film, and

a second insulating film over the electric double-layer capacitor; and

a second transistor over the second insulating film;

wherein the first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate,

wherein the first transistor includes a first semiconductor in a channel region,

wherein the second transistor includes a second semiconductor in a channel region,

wherein a band gap of the second semiconductor is wider than a band gap of the first semiconductor,

wherein one of a source and a drain of the second transistor is electrically connected to a current collector of the electric double-layer capacitor through an opening penetrating the second semiconductor,

wherein the second insulating film covers the electric double-layer capacitor, and

wherein the electric double-layer capacitor includes an ionic liquid.

10. The semiconductor device according to claim 9 ,

wherein the first semiconductor includes silicon, and

wherein the second semiconductor includes an oxide semiconductor.

11. The semiconductor device according to claim 9 , wherein the electric double-layer capacitor is capable of being charged wirelessly.

12. The semiconductor device according to claim 9 , wherein the substrate is a semiconductor substrate.

13. The semiconductor device according to claim 9 , wherein the substrate is a flexible substrate.

14. An electronic device comprising:

the semiconductor device according to claim 9 ; and

at least one of a microphone, a speaker, a display portion, and an operation key.

15. The semiconductor device according to claim 9 , wherein the channel region of the first transistor and the channel region of the second transistor overlap with each other.

Priority Claims (1)
JP 2014-162455 · Aug 8, 2014 · national
Continuity (2)
Division 14817242 · Aug 4, 2015
Related Publication 20190157262A1 · May 23, 2019