Manufacturing method of vertical GaN-based semiconductor device and vertical GaN-based semiconductor device
A manufacturing method of a vertical GaN-based semiconductor device having: a GaN-based semiconductor substrate; a GaN-based semiconductor layer including a drift region having doping concentration of an n type impurity, which is lower than that of the GaN-based semiconductor substrate, and is provided on the GaN-based semiconductor substrate; and MIS structure having the GaN-based semiconductor layer, an insulating film contacting the GaN-based semiconductor layer, and a conductive portion contacting the insulating film, the method includes: implanting an n type dopant in a back surface of the GaN-based semiconductor substrate after forming of the MIS structure, and annealing the GaN-based semiconductor substrate after the implanting of the n type dopant.
1. A vertical GaN-based semiconductor device comprising:
a GaN-based semiconductor substrate;
a GaN-based semiconductor layer including a drift region having doping concentration of an n type dopant lower than that of the GaN-based semiconductor substrate, and is provided on the GaN-based semiconductor substrate; and
MIS structure having the GaN-based semiconductor layer, an insulating film contacting the GaN-based semiconductor layer, and a conductive portion contacting the insulating film, wherein
doping concentration of an n type dopant in a lower region provided from a predetermined depth position to a back surface of the GaN-based semiconductor substrate is higher than doping concentration of an n type dopant in an upper region provided above the predetermined depth position of the GaN-based semiconductor substrate, and
the lower region includes a peak in the doping concentration, the doping concentration at the peak being higher than or equal to the doping concentration at the back surface and higher than the doping concentration at the predetermined depth position, and the upper region includes a tail region in the doping concentration, the doping concentration in the tail region decreasing from the predetermined depth position toward the GaN-based semiconductor layer.
2. The vertical GaN-based semiconductor device according to claim 1 , wherein the back surface of the GaN-based semiconductor substrate has heat resistance higher than that of a gallium polarity plane.
3. The vertical GaN-based semiconductor device according to claim 1 , wherein the back surface of the GaN-based semiconductor substrate is a nitrogen polarity plane or an m plane.
4. The vertical GaN-based semiconductor device according to claim 1 , wherein a peak of doping concentration of an n type dopant in a depth direction of the lower region is 1E+19 cm −3 or more.
5. The vertical GaN-based semiconductor device according to claim 1 , wherein carrier concentration of the lower region periodically changes in a predetermined direction of the back surface.