Hermetically sealed module unit with integrated antennas
View Patent ↗A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.
1. Module unit comprising:
a carrier substrate comprising at least one chip arranged on a first main surface and a spacer arranged on the first main surface;
an antenna substrate comprising at least one antenna structure; and
sealants which hermetically seal the antenna substrate, the spacer and the carrier substrate toward an outside;
the antenna substrate being connected to the carrier substrate by means of the spacer so that a cavity is formed between the chip and the antenna substrate;
wherein the spacer is formed by a socket.
2. Module unit as claimed in claim 1 , wherein the antenna substrate and the carrier substrate are non-conductive.
3. Module unit as claimed in claim 1 , wherein the antenna substrate and the carrier substrate comprise a ceramic material and/or a glass material.
4. Module unit as claimed in claim 1 , wherein the antenna structure is embedded into the antenna substrate or is arranged on the antenna substrate on an outside of the module unit.
5. Module unit as claimed in claim 1 , wherein the antenna substrate comprises a shielding plane between the antenna structure and the chip.
6. Module unit as claimed in claim 1 , wherein the chip is connected to the antenna structure by means of vias or electromagnetic couplers.
7. Module unit as claimed in claim 6 , wherein the via projects through the cavity or through the cavity and the antenna substrate.
8. Module unit as claimed in claim 1 , wherein the carrier substrate comprises vias or through-connections for electrically contacting the chip.
9. Module unit as claimed in claim 1 , wherein the carrier substrate comprises vias in the area of the chip which are configured to dissipate heat of the chip.
10. Module unit as claimed in claim 8 , wherein the carrier substrate comprises contact elements on outside of the module unit.
11. Module unit as claimed in claim 9 , wherein the carrier substrate comprises, on an outside of the module unit, thermal balls, a heat sink and/or cooling agents which are connected to the vias.
12. Module unit as claimed in claim 1 , wherein the spacer comprises embedded components.
13. Module unit as claimed in claim 1 , wherein the module is hermetically closed by sealants.
14. Module unit as claimed in claim 1 , wherein the spacer is locally connected, electrically and mechanically, to the antenna substrate and/or to the carrier substrate.