IP Library Granted Patent US 10,906,211
Granted Patent B2
US 10,906,211 · App. 16/065,160 · Granted Feb 2, 2021

Mold-releasable surfacing materials for composite parts

Inventors: Junjie Jeffrey Sang (Newark, DE); Dalip Kumar Kohli (Churchville, MD)
Assignee: Cytec Industries Inc.
B29C33/56B32B5/024B32B5/22B32B5/24B32B5/26B32B15/02B32B15/08B32B15/092B32B15/20B32B27/18B32B27/20B32B27/26B32B27/283B32B27/304B32B27/34B32B27/38B29C70/088B32B2250/03B32B2250/04B32B2250/05B32B2255/02B32B2255/26B32B2260/021B32B2260/046B32B2262/0261B32B2262/0276B32B2262/101B32B2264/02B32B2264/102B32B2264/105B32B2264/108B32B2307/202B32B2307/4026B32B2307/71B32B2307/748
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Quick Facts
Patent No.
US 10,906,211
App. No.
16/065,160
Granted
Feb 2, 2021
Kind
B2
Abstract

A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

Claims (37)

1. A surfacing material that is mold-releasable and electrically conductive, comprising:

(a) a microporous polymer layer bonded to one side of a woven fabric;

(b) a curable resin layer in direct contact with an opposite side of the woven fabric, said resin layer comprising one or more thermoset resins and a curing agent;

(c) a conductive layer laminated to or embedded in the curable resin layer,

wherein the microporous polymer layer comprises micron-sized pores distributed throughout the polymer layer, and

wherein the curable resin layer (b) does not comprise any reinforcement fiber.

2. The surfacing material of claim 1 , wherein the pores in the microporous polymer layer have diameters in the range of about 1 μm to about 5 μm.

3. The surfacing material of claim 1 , wherein the microporous polymer layer comprises polyamide.

4. The surfacing material according to claim 1 , wherein the microporous polymer layer comprises a fluoropolymer.

5. The surfacing material of claim 4 , wherein the fluoropolymer is selected from: polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyvinylfluoride (PVF), fluorinated ethylene-propylene (FEP), polychlorotrifluoroethylene (PCTFE), perfluoroalkoxy polymer (PFA), polyethylenetetrafluoroethylene (ETFE), polyethylenechlorotrifluoro-ethylene (ECTFE), perfluoropolyether (PFPE), and combinations thereof.

6. The surfacing material of claim 1 , wherein the curable resin layer (b) further comprises at least one Ultraviolet (UV) stabilizer or absorber and metal oxide pigments, and wherein the metal oxide pigments are present in an amount of about 40% to about 65% by weight based on the total weight of the curable resin layer.

7. The surfacing material of claim 6 , wherein the metal oxide pigments are nano-sized titanium dioxide particles having particle size in the range of about 100 nm to about 500 nm.

8. The surfacing material of claim 7 , wherein the titanium dioxide particles are in the crystalline form of rutile.

9. The surfacing material of claim 6 , wherein the UV stabilizer or absorber is selected from:

butylated hydroxytoluene (BHT); 2-hydroxy-4-methoxy-benzophenone; 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine; 3,5-di-tert-butyl-4-hydroxybenzoic acid; n-hexadecyl ester; Pentaerythritol Tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; 2-(2H-benzotriazol-2-yl)-4,6-ditertpentylphenol; Methyl 1,2,2,6,6-pentamethyl-4-piperidyl sebacate; Decanedioic acid; bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl ester; 2,2,6,6-tetramethyl-4-piperidinyl stearate; and combinations thereof.

10. The surfacing material of claim 1 , wherein the curable resin layer (b) further comprises a color pigment selected from: red iron oxide, green chromium, carbon black, and any combination thereof.

11. The surfacing material of claim 1 , wherein the curable resin layer (b) further comprises conductive particles or flakes dispersed throughout the resin layer.

12. The surfacing material of claim 1 , wherein the curable resin layer (b) comprises one or more epoxy resins.

13. The surfacing material of claim 12 , wherein the curable resin layer (b) comprises a combination of multifunctional epoxy resins, one of which is a cycloaliphatic epoxy resin represented by the following structure:

14. The surfacing material of claim 1 , wherein the conductive layer is a nonporous layer having a thickness of less than about 76 μm.

15. The surfacing material of claim 14 , wherein the conductive layer is a nonporous metal foil.

16. The surfacing material of claim 1 , wherein the conductive layer is a porous layer embedded in the curable resin layer (b) and has an areal weight within the range of about 60 gsm to about 350 gsm.

17. The surfacing material of claim 16 , wherein the conductive layer is a metal screen or an expanded metal foil.

18. The surfacing material of claim 1 , wherein the conductive layer is a sheet of carbon.

19. The surfacing material of claim 1 , wherein the woven fabric comprises fibers selected from: glass fibers, polyester fibers, polyamide fibers, and combinations thereof.

20. The surfacing material of claim 1 , wherein the surfacing material is in the form of a continuous or elongated tape having a width in the range of about 0.125 in to about 12 in.

21. A composite structure comprising:

a composite substrate comprising reinforcement fibers and a curable matrix resin;

the surfacing material of claim 1 laminated to a surface of the composite substrate such that the microporous polymer layer is an outermost layer.

22. The composite structure of claim 21 , wherein said composite substrate is a prepreg layup, which comprises a plurality of prepreg plies arranged in a stacking arrangement, each prepreg ply comprising reinforcing fibers impregnated with or embedded in a curable matrix resin.

23. A method for forming a composite structure comprising:

placing the surfacing material of claim 1 on a mold surface such that the microporous polymer layer is in contact with the mold surface;

forming a prepreg layup of multiple prepreg plies on the surfacing material, each prepreg ply comprising reinforcement fibers impregnated with or embedded in a curable matrix resin;

co-curing the surfacing material and the prepreg layup so as to form a cured composite structure;

removing the cured composite structure from the mold surface; and

removing the microporous polymer layer and the woven fabric to reveal a hardened or cured surface that is ready for painting.

24. The method according to claim 23 , further comprising applying a paint coating to the hardened or cured surface without any intervening surface treatment of the hardened or cured surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2020
From: SANG, JUNJIE JEFFREY; KOHLI, DALIP KUMAR
To: CYTEC INDUSTRIES INC.
Reel/Frame 054014/0758 →
Continuity (2)
Provisional Application 62270808 · Dec 22, 2015
Related Publication 20180370083A1 · Dec 27, 2018
Cited By (6)
US 12,350,892 US 12,350,915 US 12,377,949 US 12,466,574 US 12,521,976 US 12,589,881