Manufacturing method for display device
The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.
1. A method for manufacturing a display device, the method comprising:
forming a pattern part outside a display area of the display device, the pattern part extending in a direction along a side of a transparent encapsulation area of a first substrate or a second substrate;
forming an outer sealant parallel to the pattern part after forming the pattern part, the outer sealant being on a first side of the pattern part;
forming a transparent sealant adjacent to the pattern part after forming the pattern part, the transparent sealant being on a second side of the pattern part opposite the first side and extending in a direction parallel to the pattern part such that the transparent sealant has a predetermined interval with the outer sealant and fills between the first substrate and the second substrate; and
sealing the first substrate and the second substrate.
2. The method as claimed in claim 1 , wherein forming the transparent sealant is performed by a one-time process.
3. The method as claimed in claim 1 , wherein forming the pattern part is simultaneously performed with a step of forming a color filter in a display area of the first substrate that displays an image.
4. The method as claimed in claim 1 , wherein forming the pattern part is simultaneously performed with a step of forming a column spacer in a display area of the first substrate that displays an image.
5. The method as claimed in claim 1 , wherein sealing the first substrate and the second substrate includes:
disposing the first substrate and the second substrate so as to face each other; and
hardening the outer sealant and the transparent sealant through at least one of heating and ultraviolet (UV) light irradiation.
6. The method as claimed in claim 1 , wherein
the first substrate further includes a light blocking member including an opening, and
the transparent sealant includes an area overlapping the opening.
7. The method as claimed in claim 6 , wherein the transparent sealant includes an area completely overlapping the opening.
8. The method as claimed in claim 6 , wherein a width of the transparent sealant is larger than a diameter of the opening.
9. The method as claimed in claim 1 , wherein:
the pattern part includes first and second pattern parts, the transparent sealant extending between the first and second pattern parts,
the outer sealant includes first and second outer sealants,
the first pattern part is between the transparent sealant and the first outer sealant, and
the second pattern part is between the transparent sealant and the second outer sealant.
10. The method as claimed in claim 9 , wherein the transparent sealant is in direct contact with each of the first and second pattern parts.
11. A method for manufacturing a display device, the method comprising:
forming a pattern part extending in a direction along a side of a transparent encapsulation area of a first substrate or a second substrate, the first substrate including a light blocking member including an opening;
forming an outer sealant parallel to the pattern part;
forming a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part such that the transparent sealant has a predetermined interval with the outer sealant and fills between the first substrate and the second substrate; and
sealing the first substrate and the second substrate, wherein
the pattern part separates the transparent sealant from the outer sealant.
12. The method as claimed in claim 11 , wherein sealing the first substrate and the second substrate includes:
disposing the first substrate and the second substrate so as to face each other; and
hardening the outer sealant and the transparent sealant through at least one of heating and ultraviolet (UV) light irradiation.
13. The method as claimed in claim 11 , wherein the transparent sealant has a predetermined interval with respect to the outer sealant.
14. The method as claimed in claim 11 , further comprising forming an overcoat layer on the light blocking member such that the overcoat layer is between the light blocking layer and the transparent sealant.