IP Library Granted Patent US 10,910,249
Granted Patent B2
US 10,910,249 · App. 16/186,936 · Granted Feb 2, 2021

Systems and methods for automated wafer handling

Inventors: Feng-Lung Hsieh (Hsinchu, TW); Kuo-Hsiang Huang (Hsinchu, TW); Hung-Jen Lu (Hsinchu, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
H01L21/67724B25J9/1694B65G47/90H01L21/6773H01L21/67276H01L21/67294H01L21/67727H01L21/67733H01L21/67781B65G1/137B65G2201/0297
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Quick Facts
Patent No.
US 10,910,249
App. No.
16/186,936
Granted
Feb 2, 2021
Kind
B2
Abstract

In an embodiment a system includes: a wafer store comprising a wafer configured for processing by a semiconductor processing tool; a cart configured to transport the wafer from the wafer store along a predetermined path; a robotic arm, the robotic arm configured to: read wafer data from the wafer store, transport the wafer from the wafer store to the cart, send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.

Claims (50)

1. A system, comprising:

a wafer store comprising a wafer configured for processing by a semiconductor processing tool;

a cart configured to transport the wafer from the wafer store along a predetermined path;

a robotic arm, the robotic arm configured to:

read wafer data from the wafer store,

transport the wafer from the wafer store to the cart,

send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.

2. The system of claim 1 , wherein the robotic arm is configured to:

determine the location based on the wafer data, and

communicate the location to the cart.

3. The system of claim 1 , wherein the cart is configured to determine the location based on the wafer data.

4. The system of claim 1 , wherein the robotic arm is configured to move to the location.

5. The system of claim 1 , wherein the wafer store is configured to receive the wafer from an overhead cart suspended from a rail.

6. The system of claim 1 , wherein the wafer store is one of: a wafer stocker and a rack.

7. The system of claim 1 , wherein the location comprises: another robotic arm and another wafer store.

8. The system of claim 7 , wherein the another robotic arm is configured to:

transport the wafer from the cart to another wafer store at the location,

receive the wafer data from the cart, and

communicate the wafer data to the another wafer store.

9. A system, comprising:

a wafer store comprising a wafer configured for processing by a semiconductor processing tool;

a robotic arm configured to:

read wafer data from the wafer store,

transport the wafer from the wafer store to a cart,

the cart configured to:

receive the wafer data from the robotic arm,

transport the wafer to a location along a predetermined path in response to the wafer data, and

communicate the wafer data to another robotic arm at the location.

10. The system of claim 9 , wherein the location comprises another wafer store.

11. The system of claim 9 , wherein the predetermined path is communicated to the cart.

12. The system of claim 9 , wherein the cart comprises a sensor configured to produce sensor data, wherein the cart is further configured to move to an error location in response to the sensor data exceeding a threshold value.

13. The system of claim 12 , wherein the sensor is a timer, wherein the sensor data is a time, and wherein the cart is further configured to move to the error location in response to the time exceeding a queue threshold value.

14. The system of claim 12 , wherein:

the sensor is a vibrational sensor,

the sensor data is at least one of a velocity, acceleration, and displacement, and

the cart is further configured to move to the error location in response to the sensor data exceeding a vibrational threshold value.

15. A method, comprising:

reading, by a robotic arm, wafer data from a wafer store that comprises a wafer carrier comprising a first wafer, wherein the wafer data characterizes the first wafer;

transporting, by the robotic arm, the wafer carrier from the wafer store to a cart; and

communicating, by the robotic arm, the wafer data to the cart, wherein the cart is configured to transport the wafer carrier to an location by traveling along a predetermined path in response to receiving the wafer data.

16. The method of claim 15 , further comprising:

reading the wafer data from the wafer carrier while the wafer carrier is part of the wafer store.

17. The method of claim 15 , further comprising:

receiving wafer data associated with a second wafer that is different than the first wafer, wherein the second wafer remains at the wafer store while the first wafer is transported to the location by the cart.

18. The method of claim 15 , further comprising:

determining the location based on the wafer data.

19. The method of claim 15 , further comprising:

receiving a notification of cart availability from the cart.

20. The method of claim 15 , further comprising:

receiving the wafer data from the wafer store via a transceiver on the robotic arm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2020
From: HUANG, KUO-HSIANG; HSIEH, FENG-LUNG; LU, HUNG-JEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052301/0623 →
Continuity (2)
Provisional Application 62585458 · Nov 13, 2017
Related Publication 20190148198A1 · May 16, 2019
Cited By (1)
US 12,459,114