Vibrator device and electronic apparatus
View Patent ↗A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.
1. A vibrator device comprising:
a silicon substrate having a through hole;
a first terminal placed on a first surface of the silicon substrate;
a second terminal placed on a second surface opposite to the first surface of the silicon substrate;
a wire passing the through hole and electrically coupling the first terminal and the second terminal;
a resin layer placed between the wire and an inner wall defining the through hole;
a silicon oxide layer placed between the resin layer and the inner wall; and
a vibrator element bonded to the first terminal.
2. The vibrator device according to claim 1 , wherein
the resin layer is further placed between the first surface and the first terminal.
3. The vibrator device according to claim 2 , further comprising a lid bonded to the first surface, wherein
the lid and the silicon substrate form a cavity that accommodates the vibrator element, and
the resin layer is covered by the wire and the first terminal.
4. The vibrator device according to claim 2 , further comprising a plurality of metal bumps bonding the vibrator element and the first terminal.
5. The vibrator device according to claim 4 , wherein
the plurality of metal bumps include a first metal bump and a second metal bump, and
the through hole is placed between the first metal bump and the second metal bump in a plan view.
6. The vibrator device according to claim 4 , wherein
the plurality of metal bumps are placed along an outer edge of the through hole in a plan view.
7. The vibrator device according to claim 2 , further comprising a single metal bump bonding the vibrator element and the first terminal, wherein
the single metal bump surrounds the through hole in a plan view.
8. The vibrator device according to claim 1 , further comprising an oscillation circuit electrically coupled to the second terminal and generating an oscillation signal.
9. An electronic apparatus comprising:
the vibrator device comprising
a silicon substrate having a through hole;
a first terminal placed on a first surface of the silicon substrate;
a second terminal placed on a second surface opposite to the first surface of the silicon substrate;
a wire passing the through hole and electrically coupling the first terminal and the second terminal;
a resin layer placed between the wire and an inner wall defining the through hole;
a silicon oxide layer placed between the resin layer and the inner wall; and
a vibrator element bonded to the first terminal; and
an arithmetic circuit that operates by an output signal from the vibrator device.