Electrical binding structure and method of forming the same
An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode are respectively in contact with the micro device and the contact pad set in which at least the contact pad set and the electrode define at least one volume space. A vertical projection of the at least one volume space on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device on the substrate.
1. An electrical binding structure, comprising:
a substrate;
a contact pad set on the substrate, wherein the contact pad set comprises at least one contact pad, and the at least one contact pad is conductive;
a combination of a micro device and an electrode on the contact pad set, opposite sides of the electrode being respectively in contact with the micro device and the contact pad set, wherein at least the contact pad set and the electrode define at least one volume space, a total length of a contact periphery between the contact pad set and the electrode is greater than a total length of a primitive contact periphery between the contact pad set and the electrode as if the volume space is filled by the contact pad set when the contact pad set is on the same plane as the volume space, a vertical projection of the at least one volume space projected on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode projected on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device projected on the substrate.
2. The electrical binding structure of claim 1 , further comprising an adhesive layer between the contact pad set and the substrate.
3. The electrical binding structure of claim 1 , wherein a number of the at least one contact pad is plural.
4. The electrical binding structure of claim 1 , wherein a lateral length of the micro device is less than or equal to about 100 μm.
5. The electrical binding structure of claim 1 , wherein a number of the at least one volume space is plural.
6. An electrical binding structure, comprising:
a substrate;
a contact pad set on the substrate, wherein the contact pad set comprises at least one contact pad, and the at least one contact pad is conductive;
a combination of a micro device and an electrode on the contact pad set, opposite sides of the electrode being respectively in contact with the micro device and the contact pad set, a bottom contact surface of the electrode being in contact with a top contact surface of the contact pad set, wherein a vertical projection of one of the bottom contact surface and the top contact surface projected on the substrate is divided into at least one overlapped portion and at least one non-overlapped portion based on a vertical projection of another of the bottom contact surface and the top contact surface projected on the substrate, and the at least one overlapped portion and the at least one non-overlapped portion are enclosed by a vertical projection of an outer periphery of the micro device projected on the substrate, such that a total length of a contact periphery between the contact pad set and the electrode is greater than a total length of a primitive contact periphery between the contact pad set and the electrode as if the at least one non-overlapped portion is filled by the contact pad set when the contact pad set is on the same plane as the at least one non-overlapped portion.