Electronic component, camera module, and method for manufacturing electronic component
To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.
1. An electronic component, comprising:
a circuit board having a first face, a second face opposite to the first face, and a first opening;
a light transmitting member on the first face of the circuit board;
an imaging device flip-chip mounted on the second face of the circuit board, wherein the imaging device comprises a light receiving face on a side opposing the light transmitting member;
a light absorption member between the circuit board and the light transmitting member, wherein the light absorption member is in a region other than the first opening in plan view on the first face of the circuit board; and
a light shielding member on at least one the first face or the second face of the circuit board outside the light transmitting member in the plan view, wherein the light shielding member is made of a metal film.
2. The electronic component according to claim 1 , wherein the light absorption member has a second opening at a position corresponding to the first opening of the circuit board.
3. The electronic component according to claim 2 , wherein an opening peripheral end face of the second opening of the light absorption member is aligned with an opening peripheral end face of the first opening of the circuit board.
4. The electronic component according to claim 2 , wherein an opening peripheral end face of the second opening of the light absorption member is outside an opening peripheral end face of the first opening of the circuit board in the plan view with respect to an arrangement of the imaging device.
5. The electronic component according to claim 1 , wherein the light absorption member comprises at least one of a member made of dye that contains a black material, or a film that contains a black material.
6. The electronic component according to claim 5 , wherein the black material comprises a carbon material.
7. The electronic component according to claim 1 , wherein the light absorption member comprises adhesive resin to fix the circuit board and the light transmitting member.
8. The electronic component according to claim 1 , wherein
the light transmitting member has an outer peripheral end face, and
the light shielding member is at least on the outer peripheral end face of the light transmitting member.
9. An electronic component, comprising:
a circuit board having a first face, a second face opposite to the first face, and an opening;
a light transmitting member on the first face of the circuit board, wherein the light transmitting member has an outer peripheral end face;
an imaging device flip-chip mounted on the second face of the circuit board, wherein the imaging device comprises a light receiving face on a side opposing the light transmitting member; and
a light shielding member at least on the outer peripheral end face of the light transmitting member, wherein the light shielding member is made of a metal film.
10. The electronic component according to claim 9 , further comprising
an encapsulation resin between the circuit board and the imaging device, wherein
the encapsulation resin configured to seal the circuit board and the imaging device, and
the light shielding member is on an outer surface of the encapsulation resin.
11. The electronic component according to claim 9 , wherein the light shielding member is on at least one of the first face or the second face of the circuit board outside the light transmitting member in plan view.
12. The electronic component according to claim 11 , wherein the light shielding member is on both the first face and the second face.
13. The electronic component according to claim 9 , wherein the light shielding member is on a face opposite to the light receiving face of the imaging device.
14. The electronic component according to claim 9 , wherein the light shielding member is in at least part of a region other than the opening of the circuit board in plan view on a face of the light transmitting member opposite to a side where the imaging device is provided.
15. A camera module, comprising:
a circuit board having a first face, a second face opposite to the first face, and an opening;
a light transmitting member on the first face of the circuit board;
a lens unit opposite to a side of the light transmitting member opposing the circuit board;
an imaging device flip-chip mounted on the second face of the circuit board, wherein the imaging device comprises a light receiving face on a side opposing the light transmitting member;
a light absorption member between the circuit board and the light transmitting member, wherein the light absorption member is in a region other than the opening in plan view on the first face of the circuit board; and
a light shielding member on at least one the first face or the second face of the circuit board outside the light transmitting member in the plan view, wherein the light shielding member is made of a metal film.
16. A camera module, comprising:
a circuit board having a first face, a second face opposite to the first face, and an opening;
a light transmitting member on the first face of the circuit board, wherein the light transmitting member has an outer peripheral end face;
a lens unit opposite to a side of the light transmitting member opposing the circuit board;
an imaging device flip-chip mounted on the second face of the circuit board, wherein the imaging device comprises a light receiving face on a side opposing the light transmitting member; and
a light shielding member at least on the outer peripheral end face of the light transmitting member, wherein the light shielding member is made of a metal film.
17. A method for manufacturing an electronic component, comprising:
forming a light absorption member on a first face of a circuit board, wherein the circuit board has the first face and a second face opposite to the first face;
forming an opening on the circuit board with the light absorption member formed;
flip-chip mounting an imaging device having a light receiving face on the second face of the circuit board, wherein the light receiving face opposes the opening of the circuit board;
providing a light transmitting member to oppose the first face of the circuit board, wherein the light absorption member is between the light transmitting member and the circuit board; and
forming a light shielding member on at least one the first face or the second face of the circuit board outside the light transmitting member in plan view, wherein the light shielding member is made of a metal film.
18. A method for manufacturing an electronic component, comprising:
forming a light absorption member in a region other than in an opening on a first face of a circuit board, wherein the circuit board has the first face, a second face opposite to the first face, and the opening in plan view;
flip-chip mounting an imaging device having a light receiving face on the second face of the circuit board, wherein the light receiving face opposes the opening of the circuit board;
providing a light transmitting member to oppose the first face of the circuit board, wherein the light absorption member is between the light transmitting member and the circuit board; and
forming a light shielding member on at least one the first face or the second face of the circuit board outside the light transmitting member in the plan view, wherein the light shielding member is made of a metal film.