IP Library Granted Patent US 10,919,798
Granted Patent B2
US 10,919,798 · App. 16/249,199 · Granted Feb 16, 2021

Articles with patterned coatings

Inventors: Shandon Dee Hart (Corning, NY); Guangli Hu (Berkeley Heights, NJ); Nicholas James Smith (State College, PA)
Assignee: Corning Incorporated
C03C17/007C01B33/18C01G19/006C03C3/091C03C3/093C03C4/18C03C17/006C03C17/23C03C17/2453C03C17/3657C09D1/00C09D1/02C03C2204/00C03C2217/213C03C2217/231C03C2217/42C03C2217/43C03C2217/478C03C2217/732C03C2217/78C03C2217/948C03C2218/154C03C2218/328C03C2218/34Y10T428/24917Y10T428/24926
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Quick Facts
Patent No.
US 10,919,798
App. No.
16/249,199
Granted
Feb 16, 2021
Kind
B2
Abstract

Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Claims (14)

1. An article, comprising: a continuous patterned coating with a bimodal distribution of coating thickness, the bimodal distribution comprising a lower-mode thickness in a range from 10 nm to 90 nm, and a higher-mode thickness in a range from about 50 nm to about 5000 nm,

wherein the lower-mode thickness comprises a full-width-at half-maximum (FWHM) of about 1 nm or less and the higher-mode thickness comprises a FWHM greater than the FWHM of the lower-mode thickness.

2. The article of claim 1 , wherein, when a strain is applied to the article, the patterned coating has a first region and a second region, and wherein the first region comprises a first tensile stress and the second region comprises a second tensile stress greater than the first tensile stress.

3. The article of claim 1 , further comprising a substrate, whereby the patterned coating is disposed on a surface of the substrate.

4. The article of claim 3 , wherein, when a strain is applied to the article, the substrate comprises a maximum substrate tensile stress and the patterned coating has at least one local region comprising a local tensile stress that is less than the maximum substrate tensile stress.

5. The article of claim 3 , wherein, when a strain is applied to the article, the substrate comprises a maximum substrate tensile strain and the patterned coating has at least one local region comprising a local tensile strain that is less than the maximum substrate tensile strain.

6. The article of claim 1 , wherein the FWHM of the higher-mode thickness is less than differences in surface topographical heights of the lower-mode thickness and the higher-mode thickness.

7. The article of claim 6 , wherein the patterned coating comprises a plurality of peaks and a plurality of valleys between the peaks.

8. The article of claim 7 , wherein the patterned coating at the plurality of valleys comprises a coating thickness of at least about 5 nm.

9. The article of claim 3 , wherein the substrate exhibits an average strain-to-failure that is greater than an amount selected from 0.7%, 1.0%, 1.5%, 2%, 2.5% and 3%.

10. The article of claim 1 , wherein the patterned coating comprises a hardness of 8 GPa or greater, as measured by a Berkovich Indenter Hardness Test along indentation depths of about 100 nm or greater.

11. A consumer electronic device, comprising: a patterned coating with a bimodal distribution of coating thickness, the bimodal distribution having a lower-mode thickness comprising a full-width-at half-maximum (FWHM) of about 1 nm or less, and a higher-mode thickness comprising a FWHM greater than the FWHM of the lower-mode thickness,

wherein the lower-mode thickness is in a range from 10 nm to 90 nm, and the higher-mode thickness is in a range from about 200 nm to about 5000 nm, and further wherein the patterned coating is continuous.

12. The consumer electronic device of claim 11 , wherein the FWHM of the higher-mode thickness is less than the difference in surface topographical heights of the lower-mode thickness and the higher-mode thickness.

Continuity (4)
Continuation 15128004
Provisional Application 61977688 · Apr 10, 2014
Provisional Application 61968519 · Mar 21, 2014
Related Publication 20190144331A1 · May 16, 2019