Electronic component
An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A-A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.
1. An electronic component comprising:
a multilayer ceramic capacitor including a capacitor body, and first and second external electrodes respectively disposed on end surfaces of the capacitor body opposing each other in a length direction of the capacitor body and respectively having first and second band portions extending onto one of side surfaces of the capacitor body connecting the end surfaces of the capacitor body to each other;
an interposer including an interposer body having grooves in surfaces opposing each other in the length direction, and first and second external terminals respectively disposed at ends of the interposer body opposing each other in the length direction; and
conductive adhesive portions disposed between the external electrodes and the external terminals, respectively,
wherein Lc≤Li, in which Lc is a distance in the length direction between centers of the first and second band portions of the first and second external electrodes, and Li is a shortest distance in the length direction between connection portions disposed on the grooves in the opposite surfaces of the interposer body, and
each of the grooves includes a single curved surface directly connecting to each other side surfaces of the interposer body opposing each other in a width direction of the capacitor body.
2. The electronic component of claim 1 , wherein the multilayer ceramic capacitor has a length of 0.8 mm or less and a width of 0.4 mm or less.
3. The electronic component of claim 1 , wherein the multilayer ceramic capacitor has a thickness of 0.7 mm or less.
4. The electronic component of claim 1 , wherein the first external terminal includes a first bonding portion disposed on a portion of an upper surface of the interposer body and connected to the first band portion of the first external electrode, a first mounting portion disposed on a portion of a lower surface of the interposer body, and a first connection portion disposed on one of the grooves of the interposer body to connect the first bonding portion and the first mounting portion to each other,
the second external terminal includes a second bonding portion disposed on another portion of the upper surface of the interposer body and connected to the second band portion of the second external electrode, a second mounting portion disposed on another portion of the lower surface of the interposer body, and a second connection portion disposed on the other of the grooves of the interposer body to connect the second bonding portion and the second mounting portion to each other.
5. The electronic component of claim 1 , wherein the interposer body includes an insulator.
6. An electronic component comprising:
a multilayer ceramic capacitor including a capacitor body, and first and second external electrodes respectively disposed on end surfaces of the capacitor body opposing each other in a length direction of the capacitor body and respectively having first and second band portions extending onto one of side surfaces of the capacitor body connecting the end surfaces of the capacitor body to each other;
an interposer including an interposer body having grooves in surfaces opposing each other in the length direction, and first and second external terminals respectively disposed at ends of the interposer body opposing each other in the length direction; and
conductive adhesive portions disposed between the external electrodes and the external terminals, respectively,
wherein Lc≤Li, in which Lc is a distance in the length direction between centers of the first and second band portions of the first and second external electrodes, and Li is a shortest distance in the length direction between connection portions disposed on the grooves in the opposite surfaces of the interposer body,
a length of the multilayer ceramic capacitor in the length direction is greater than a longest length of the interposer in the length direction, and
each of the grooves includes a single curved surface directly connecting to each other side surfaces of the interposer body opposing each other in a width direction of the capacitor body.
7. The electronic component of claim 6 , wherein the multilayer ceramic capacitor has a length of 0.8 mm or less and a width of 0.4 mm or less.
8. The electronic component of claim 7 , wherein the multilayer ceramic capacitor has a thickness of 0.7 mm or less.
9. The electronic component of claim 6 , wherein the first external terminal includes a first bonding portion disposed on a portion of an upper surface of the interposer body and connected to the first band portion of the first external electrode, a first mounting portion disposed on a portion of a lower surface of the interposer body, and a first connection portion disposed on one of the grooves of the interposer body to connect the first bonding portion and the first mounting portion to each other,
the second external terminal includes a second bonding portion disposed on another portion of the upper surface of the interposer body and connected to the second band portion of the second external electrode, a second mounting portion disposed on another portion of the lower surface of the interposer body, and a second connection portion disposed on the other of the grooves of the interposer body to connect the second bonding portion and the second mounting portion to each other.
10. The electronic component of claim 9 , wherein the conductive adhesive portions are disposed between the first band portion of the first external electrode and the first bonding portion of the first external terminal and between the second external electrode and the second bonding portion of the second external terminal, respectively.
11. The electronic component of claim 6 , wherein the interposer body includes an insulator.