Interconnect structure and method of forming the same
A semiconductor device is provided. The semiconductor device can have a substrate including dielectric material. A plurality of narrow interconnect openings can be formed within said dielectric material. In addition, a plurality of wide interconnect openings can be formed within said dielectric material. The semiconductor device can include a first metal filling the narrow interconnect openings to form an interconnect structure and conformally covering a surface of the wide interconnect openings formed in the dielectric material, and a second metal formed over the first metal and encapsulated by the first metal to form another interconnect structure within the wide interconnect openings.
1. A method for fabricating a semiconductor device, the method comprising:
forming a dielectric material on a substrate;
forming a first interconnect opening and a second interconnect opening within the dielectric material;
depositing a first metal on the first interconnect opening and the second interconnect opening, the first metal filling the first interconnect opening fully to form a first interconnect structure, and conformally covering a surface of the second interconnect opening;
depositing a second metal over the first metal in the second interconnect opening;
recessing the second metal within the second interconnect opening;
depositing the first metal over the second metal to fill the second interconnect opening so as to form a second interconnect structure, the second metal being encapsulated by the first metal in the second interconnect structure; and
planarizing the semiconductor device so that a top surface of the dielectric material, a top surface of the first metal in the first interconnect opening and a top surface of the first metal in the second interconnect opening are co-planar, wherein the first metal is made of a first material, and the second metal is made of a second material.
2. The method of claim 1 , further comprising, after the planarizing the semiconductor device, recessing the first metal, wherein the top surface of the first metal in the first interconnect opening and the top surface of the first metal in the second interconnect opening are lower than the top surface of the dielectric material.
3. The method of claim 1 , wherein forming the dielectric material comprises forming a plurality of conductive layers within the dielectric material.
4. The method of claim 3 , wherein forming the conductive layers within the dielectric material comprises forming the conductive layers at a bottom of the first interconnect opening and a bottom of the second interconnect opening, at least one of the conductive layers being in direct contact with the first metal filled in the first interconnect opening or the first metal filled in the second interconnect opening.
5. The method of claim 1 , wherein forming the second interconnect opening comprises forming a trench opening and a via opening within the dielectric material.
6. The method of claim 5 , wherein forming the second interconnect opening within the dielectric material comprises:
forming a hard mask stack over the dielectric material;
performing a first etching process to etch the hard mask stack to pattern the hard mask stack;
coating a spin on carbon (SOC) layer over the patterned hard mask stack and patterning the SOC layer;
performing a second etching process to etch down into the dielectric material by using the patterned SOC layer as a mask;
removing the SOC layer; and
performing a third etching process to etch down into the dielectric material by using the patterned hard mask stack as a mask to complete the formation of the second interconnect opening having a trench opening and a via opening within the dielectric material.
7. The method of claim 6 , wherein depositing the second metal over the first metal in the second interconnect opening comprises forming a second metal layer over the first metal, the second metal layer including a first portion over the top surface of the dielectric material, a second portion over a bottom of the trench opening of the second interconnect opening, and a third portion along sidewalls of the trench opening of the second interconnect opening.
8. The method of claim 7 , wherein recessing the second metal comprising fully removing the first portion of the second metal layer over the top surface of the dielectric material and the second portion of the second metal layer along the sidewalls of the trench opening of the second interconnect opening, and partially removing the third portion of the second metal layer over the bottom of the trench opening of the second interconnect opening.
9. The method of claim 1 , wherein the first metal comprises at least one of ruthenium (Ru), copper (Cu), tungsten (W), aluminum (Al), or cobalt (Co).
10. The method of claim 1 , wherein the second interconnect opening has a bigger feature size as compared to a feature size of the first interconnect opening.
11. The method of claim 1 , wherein the second metal has a lower resistivity than a resistivity of the first metal.