Method of fabricating rigid island pattern on stretchable layer with low Young's modulus and stretchable electronic device platform using the same
View Patent ↗A method of fabricating a rigid island pattern on a stretchable layer having a low Young's modulus and a stretchable electronic device platform using the same are disclosed. The stretchable electronic device platform, which is proposed by the present disclosure and has the rigid island pattern on the stretchable layer having a low Young's modulus, includes a stretchable substrate having a first Young's modulus, a Silbione® layer coated with a stretchable layer having a Young's modulus lower than the first Young's modulus on the stretchable substrate, and a fixed layer which is made of a photoresist such as SU-8 or a UV curable resin and has a Young's modulus higher than the first Young's modulus, and in which the rigid island pattern and the meandering stretchable interconnector pattern are formed on the stretchable layer by a photolithography process.
1. A stretchable electronic device platform comprising:
a stretchable substrate having a first Young's modulus;
a stretchable layer disposed on the stretchable substrate, wherein the stretchable layer has a second Young's modulus lower than the first Young's modulus; and
a rigid fixed layer having a third Young's modulus higher than the first Young's modulus and including a rigid island and an interconnector,
wherein one entire surface of the rigid fixed layer contacts with the stretchable layer, and
wherein the rigid fixed layer is fully supported by the stretchable layer such that strain and stress applied to the rigid fixed layer are reduced when the stretchable electronic device platform is stretched.
2. The platform of claim 1 , wherein deformation does not occur in the fixed layer, and the deformation is concentrated on the stretchable substrate and the stretchable layer.
3. The platform of claim 2 , wherein when stretching is applied to an entire system, the smaller the Young's modulus of the stretchable layer, the less strain and stress distribution of the rigid island and the interconnector.
4. The platform of claim 1 , wherein a metal and an organic semiconductor are deposited on the fixed layer to fabricate stretchable organic optoelectronic and electronic devices.
5. The platform of claim 4 , wherein in the stretchable organic optoelectronic and electronic devices, various electronic and optoelectronic devices are formed on the rigid island of the fixed layer, wherein the various electronic and optoelectronic devices are composed of layers of a conductor and a semiconductor, an insulator, and the like capable of being deposited within a temperature range at which the stretchable substrate, the stretchable layer, and the fixed layer withstand.