Method for manufacturing doubly re-entrant microstructures
A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.
1. A method of making microstructures having doubly re-entrant shapes comprising:
forming a rigid mold defining negative surface features of the doubly re-entrant shapes;
applying flowable material on a surface of a first substrate;
physically placing the rigid mold against the surface of the first substrate to interpose the flowable material between the negative surface features of the rigid mold and the first substrate, wherein the flowable material solidifies to form positive surface features of the doubly re-entrant shapes as defined by the rigid mold;
physically parting the rigid mold from the first substrate, forming solid microstructures having the doubly re-entrant shapes disposed on the first substrate with a top portion of the microstructures being secured to the first substrate;
securing a bottom portion of the microstructures to a second substrate; and
removing the first substrate from the top portion of the microstructures to form the microstructures having the doubly re-entrant shapes on the second substrate.
2. The method of claim 1 , wherein a residual layer of solidified flowable material connects adjacent tops of the microstructures and wherein the residual layer is removed by plasma etching, wet chemical etching, or mechanical polishing.
3. The method of claim 1 , wherein the second substrate is flexible.
4. The method of claim 1 , wherein the second substrate is made of the same material as the microstructures.
5. The method of claim 1 , wherein the microstructures are secured to the second substrate through one of: an adhesive layer disposed on the second substrate; a local fusion layer on the microstructures; welds; or direct bonding.
6. The method of claim 1 , further comprising conformally coating a hydrophobic material on the microstructures.
7. The method of claim 1 , wherein the rigid mold is formed by applying a plurality of mask layers and anisotropic etching into the rigid mold to form the negative surface features of the doubly re-entrant shapes.
8. The method of claim 1 , wherein the rigid mold comprises silicon or silica.
9. The method of claim 1 , wherein the flowable material comprises a polymer.
10. The method of claim 9 , wherein the polymer comprises one of silicone, polycarbonate, polyethylene, polymethyl methacrylate, and fluoropolymer.
11. A method of making microstructures having doubly re-entrant shapes comprising:
forming a rigid mold defining negative surface features of the doubly re-entrant shapes;
physically placing the surface of the rigid mold with the negative surface features against a first substrate, wherein spaces are formed between the negative surface features and the first substrate;
filling a material in the spaces between the negative surface features of the rigid mold and the first substrate, wherein the filled material forms positive surface features of the doubly re-entrant shapes as defined by the rigid mold;
physically parting the rigid mold from the first substrate, forming solid microstructures having the doubly re-entrant shapes disposed on the first substrate with a top portion of the microstructures being secured to the first substrate;
securing a bottom portion of the microstructures to a second substrate; and
removing the first substrate from the top portion of the microstructures to form the microstructures having the doubly re-entrant shapes on the second substrate.
12. The method of claim 11 , wherein a residual layer of solidified flowable material connects adjacent tops of the microstructures and wherein the residual layer is removed by plasma etching, wet chemical etching, or mechanical polishing.
13. The method of claim 11 , wherein the second substrate is flexible.
14. The method of claim 11 , wherein the second substrate is made of the same material as the microstructures.
15. The method of claim 11 , wherein the rigid mold is formed by applying a plurality of mask layers and anisotropic etching into the rigid mold to form the negative of the doubly re-entrant shapes.
16. The method of claim 11 , wherein the rigid mold is made from silicon or silica.
17. The method of claim 11 , wherein the filling material in the spaces between the negative surface features of the rigid mold and the first substrate comprises a metal.
18. The method of claim 11 , wherein the filling material in the spaces between the negative surface features of the rigid mold and the first substrate comprises a condensable material.
19. The method of claim 11 , wherein a hydrophobic material is coated conformally on the microstructures.
20. A method of making microstructures having doubly re-entrant shapes comprising:
forming a rigid mold defining negative surface features of the doubly re-entrant shapes;
applying flowable material on a surface of a first substrate;
physically placing the rigid mold against the surface of the first substrate to interpose the flowable material between the negative surface features of the rigid mold and the first substrate, wherein the flowable material solidifies to form positive surface features of the doubly re-entrant shapes as defined by the rigid mold;
physically parting the rigid mold from the first substrate, forming solid microstructures on the first substrate having the doubly re-entrant shapes that are free of any surrounding material between the solid microstructures, the solid microstructures disposed with a top portion of the microstructures being secured to the first substrate;
securing a bottom portion of the microstructures to a second substrate; and
physically removing the first substrate from the top portion of the microstructures to form the microstructures having the doubly re-entrant shapes on the second substrate.