IP Library › Granted Patent US 10,928,448
Granted Patent B2
US 10,928,448 · App. 16/686,699 · Granted Feb 23, 2021

Automated scan chain diagnostics using emission

Inventors: Franco Stellari (Waldwick, NJ); Peilin Song (Lagrangeville, NY)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
G01R31/31728G01R31/311G06F30/398
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,928,448
App. No.
16/686,699
Granted
Feb 23, 2021
Kind
B2
Abstract

A method for automated scan chain diagnostics includes comparing actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout, and determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

Claims (33)

1. A method for automated scan chain diagnostics, comprising:

comparing actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout; and

determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

2. The method of claim 1 , further comprising selecting a next test location on the device in accordance with a logic path on the design layout, and navigating to the next test location to generate a next image of the device.

3. The method of claim 2 , wherein selecting the next test location further includes selecting a location earlier in the logic path if an error is located and selecting a location later in the logic path if an error is not located, wherein the next location selected maximizes coverage of the logic path in a minimum number of acquisitions.

4. The method of claim 1 , further comprising segmenting the image, including converting layout polygons to equivalent pixels at a same scale as the image.

5. The method of claim 4 , further comprising generating a predictive signature mask that represents locations of expected emissions based on the design layout and the expected emission signatures, and determining how well the predictive signature mask matches measured emissions in the image based on a figure of merit.

6. The method of claim 5 , further comprising optimizing an alignment between the image and the design layout to maximize the figure of merit.

7. The method of claim 5 , further comprising calculating the figure of merit as a two-dimensional cross-correlation between the image and the predictive signature mask.

8. The method of claim 5 , wherein generating the predictive signature mask further includes identifying layout elements that are expected to have a high-intensity and repetitive emission signature to form the predictive signature mask as a map of such layout elements.

9. The method of claim 1 , further comprising:

acquiring the image using a camera;

registering the image to the design layout; and

segmenting the image based on the registration.

10. The method of claim 9 , wherein registering the image further includes registering a pattern image of the device that includes non-emission information and a processed layout mask.

11. A computer program product comprising a non-transitory computer readable storage medium comprising a computer readable program for automated scan chain diagnostics, wherein the computer readable program when executed on a computer causes the computer to perform a method comprising:

comparing actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout; and

determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

12. A system for automated scan chain diagnostics, comprising:

at least one processor device configured to:

compare actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout; and

determine whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

13. The system of claim 12 , wherein the at least one processor device is further configured to select a next test location on the device in accordance with a logic path on the design layout, and to navigate to the next test location to generate a next image of the device.

14. The system of claim 13 , wherein the at least one processor device is further configured to select a location earlier in the logic path if an error is located and to select a location later in the logic path if an error is not located, wherein the next location selected maximizes coverage of the logic path in a minimum number of acquisitions.

15. The system of claim 12 , wherein the at least one processor device is further configured to convert layout polygons to equivalent pixels at a same scale as the image.

16. The system of claim 15 , wherein the at least one processor device is further configured to generate a predictive signature mask that represents locations of expected emissions based on the design layout and the expected emission signatures and to determine how well the predictive signature mask matches measured emission in the image based on a figure of merit.

17. The system of claim 16 , wherein the at least one processor device is further configured to optimize an alignment between the image and the design layout to maximize the figure of merit.

18. The system of claim 16 , wherein the at least one processor device is further configured to calculate the figure of merit as a two-dimensional cross-correlation between the image and the predictive signature mask.

19. The system of claim 16 , wherein the at least one processor device is further configured to generate the predictive signature mask by identifying layout elements that are expected to have a high-intensity and repetitive emission signature to create and form the predictive signature mask as a map of such layout elements.

20. The system of claim 12 , wherein the at least one processor device is further configured to:

acquire the image using a camera; and

register the image to the design layout by registering a pattern image of the device that includes non-emission information and a processed layout mask; and

segment the image based on the registration.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2019
From: STELLARI, FRANCO; SONG, PEILIN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 051037/0185 →
Continuity (3)
Continuation 16297011 · Mar 8, 2019
Continuation 14945892 · Nov 19, 2015
Related Publication 20200088791A1 · Mar 19, 2020
Cited By (1)
US 12,675,625