IP Library › Granted Patent US 10,930,700
Granted Patent B2
US 10,930,700 · App. 16/597,124 · Granted Feb 23, 2021

Semiconductor light detection element

Inventors: Tatsuki Kasuya (Hamamatsu, JP); Takeshi Kawahara (Hamamatsu, JP); Yasuhito Miyazaki (Hamamatsu, JP); Kentaro Maeta (Hamamatsu, JP); Hisanori Suzuki (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
H01L27/14806H01L27/148H01L31/02363H01L31/02366H01L31/022408H01L31/103
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Quick Facts
Patent No.
US 10,930,700
App. No.
16/597,124
Granted
Feb 23, 2021
Kind
B2
Abstract

A semiconductor photodetector includes a semiconductor substrate including a silicon substrate. The semiconductor substrate includes a second main surface as a light incident surface and a first main surface opposing the second main surface. In the semiconductor substrate, carriers are generated in response to incident light. A plurality of protrusions is formed on the second main surface. The protrusion includes a slope inclined with respect to a thickness direction of the semiconductor substrate. At the protrusion, a (111) surface of the semiconductor substrate is exposed as the slope. The height of the protrusion is equal to or more than 200 nm.

Claims (22)

1. A semiconductor photodetector, comprising a silicon substrate including a light incident surface and a back surface opposing the light incident surface and configured to generate carriers in response to incident light,

wherein a plurality of protrusions including slopes inclined with respect to a thickness direction of the silicon substrate is formed on the light incident surface,

a (111) surface of the silicon substrate is exposed as the slope at each protrusion,

a height of each protrusion is equal to or more than 200 nm, and

an interval between apexes of two adjacent protrusions of the plurality of protrusions is 500 to 3000 nm.

2. The semiconductor photodetector according to claim 1 ,

wherein a semiconductor region having a conductivity type different from that of the silicon substrate is provided on the back surface side of the silicon substrate,

an accumulation layer is provided on the light incident surface side of the silicon substrate, and

the slope of the protrusion is included in a surface of the accumulation layer.

3. The semiconductor photodetector according to claim 1 ,

wherein a semiconductor region having a conductivity type different from that of the silicon substrate is provided on the light incident surface side of the silicon substrate.

4. The semiconductor photodetector according to claim 1 , further comprising:

an oxide film disposed on the light incident surface and configured to transmit the incident light, and

an electrode film disposed on the oxide film and configured to transmit the incident light and be connected to a predetermined potential.

5. The semiconductor photodetector according to claim 4 ,

wherein the electrode film includes a film made of graphene.

6. The semiconductor photodetector according to claim 4 ,

wherein the oxide film includes a silicon oxide film.

7. The semiconductor photodetector according to claim 4 ,

wherein the oxide film includes an aluminum oxide film.

8. The semiconductor photodetector according to claim 1 , further comprising

a film disposed on the light incident surface, configured to transmit the incident light, and containing boron.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2019
From: KASUYA, TATSUKI; KAWAHARA, TAKESHI; MIYAZAKI, YASUHITO; MAETA, KENTARO; SUZUKI, HISANORI
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 050666/0065 →
Priority Claims (1)
JP JP2016-041027 · Mar 3, 2016 · national
Continuity (2)
Continuation 16081208
Related Publication 20200043974A1 · Feb 6, 2020
Cited By (1)
US 12,613,197