Nanosheet FET bottom isolation
A technique relates to a semiconductor device. A rare earth material is formed on a substrate. An isolation layer is formed at an interface of the rare earth material and the substrate. Channel layers are formed over the isolation layer. Source or drain (S/D) regions are formed on the isolation layer.
1. A method of forming a semiconductor device, the method comprising:
forming a rare earth material in direct contact with and on a substrate;
forming an isolation layer at an interface between and in direct contact with both the rare earth material and the substrate;
forming channel layers over the isolation layer; and
forming source or drain (S/D) regions on the isolation layer, the S/D regions and the isolation layer sandwiching the rare earth material, the S/D regions being in direct contact with the rare earth material.
2. The method of claim 1 further comprising forming a dielectric layer on the channel layers.
3. The method of claim 2 further comprising forming one or more work function materials on the channel layers.
4. The method of claim 2 , wherein the one or more work function materials are on the isolation layer.
5. The method of claim 2 , wherein the isolation layer separates a portion of the one or more work function materials from the substrate.
6. The method of claim 1 , wherein the isolation layer physically separates and electrically isolates the S/D regions from the substrate.
7. The method of claim 1 , wherein the rare earth material comprises a rare earth oxide.
8. The method of claim 1 , wherein the rare earth material comprises a rare earth oxide with a cubic lattice.
9. The method of claim 1 , wherein the rare earth material comprises a rare earth oxide having a lattice constant that comprises about twice a lattice constant of a material of the substrate.
10. The method of claim 1 , wherein a lattice structure of the rare earth material substantially matches a lattice structure of the channel layers.
11. The method of claim 1 , wherein forming the isolation layer at the interface of the rare earth material on the substrate comprises diffusing oxygen through the isolation layer and growing the isolation layer at the interface.
12. The method of claim 1 , wherein the isolation layer comprises an oxide material.
13. The method of claim 1 , wherein the isolation layer is formed as an oxide of a material of the substrate.
14. A method of forming an isolation layer for a semiconductor device, the method comprising:
forming a rare earth oxide material in direct contact with and on a substrate;
diffusing oxygen through the rare earth oxide material such that an oxide is grown at an interface between and in direct contact with both the rare earth oxide material and the substrate, the oxide being the isolation layer;
forming channel layers over the isolation layer; and
forming source or drain (S/D) regions on the isolation layer, the S/D regions and the isolation layer sandwiching the rare earth material, the S/D regions being in direct contact with the rare earth material.